Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Welded type COB (chip on board)-LED light source module

A COB-LED and light source module technology, which is applied in the field of LED lighting, can solve the problems of troublesome processing and disassembly, unfavorable heat dissipation of COB-LED light source components, and many parts.

Inactive Publication Date: 2015-04-22
KINGSUN OPTOELECTRONIC CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the existing light source modules packaged with COB-LED chips adopt the GE standard structure of the United States. The structure is to screw the COB-LED light source assembly above the middle through hole of the electrical interface bracket through screws. The assembly method is not conducive to the heat dissipation of the COB-LED light source component, and the lead-out of the core wire of this structure requires more space, which makes the product structure not compact enough. In addition, the structure requires screws and The structure of the screw hole has many parts, and it is troublesome to process and disassemble.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welded type COB (chip on board)-LED light source module
  • Welded type COB (chip on board)-LED light source module
  • Welded type COB (chip on board)-LED light source module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will be combined with Figure 1-6 An example for further details:

[0025] A welded COB-LED light source module in the embodiment includes a reflector 10, a heat sink 20, a COB-LED light source assembly 30, an electrical interface bracket 40 and a welding core wire 50. The COB-LED light source assembly 30 is The LED chip 31 is directly mounted on the PCB board 32 and then electrically connected and packaged as a whole through lead stitching;

[0026] The middle part of the electrical interface bracket 40 has a through hole 41 corresponding to the LED chip, and the bottom surface of the electrical interface bracket 40 has a mounting groove 42 with the same size and shape as the PCB board 32. Two wire slots 43 respectively corresponding to the two welding points 321 on the PCB board 32 are opened on the side; the welding core wire 50 is composed of two single core wires 51 for welding; the electrical interface bracket 40 The inner wall of the through hole ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a welded type COB (chip on board)-LED light source module which comprises a reflection cup, a radiator, a COB-LED light source component, an electrical interface support and a welding core wire. When the welded type COB-LED light source module is assembled, ends of two single-core wires of the welding core wire are correspondingly welded on corresponding welding points on a PCB (printed circuit board), the PCB in the COB-LED light source component is mounted in a mounting groove on the bottom surface of the electrical interface support, an LED chip in the COB-LED light source component exposes outside through a through hole in the middle of the electrical interface support, the two single-core wires welded on the PCB are led out through corresponding lead grooves respectively, and a plurality of screws penetrate through corresponding mounting holes to enable the electrical interface support and the COB-LED light source component to be in threaded connection on corresponding threaded holes of the radiator. By the structure, the welded type COB-LED light source module is compact in structure, convenient to assemble and disassemble, space-saving and good in radiating effect.

Description

technical field [0001] The invention relates to the technical field of LED lighting using a COB-LED chip packaged light source module, in particular to a welded COB-LED light source module. Background technique [0002] In the light source module of LED lighting, the use of COB-LED chip packaging—that is, the LED chip packaging on the PCB is gradually warming up with the characteristics of low cost and good heat dissipation, and gradually enters the field of vision of LED enterprises and consumers. [0003] At present, most of the existing light source modules packaged with COB-LED chips adopt the GE standard structure of the United States. The structure is to screw the COB-LED light source assembly above the middle through hole of the electrical interface bracket through screws. The assembly method is not conducive to the heat dissipation of the COB-LED light source component, and the export of the core wire of this structure requires more space, which makes the product str...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V29/00F21V17/10F21Y101/02F21V29/503F21V29/77
Inventor 李善良
Owner KINGSUN OPTOELECTRONIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products