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Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve

A domino and positive cycle technology, applied in the field of cycle doors, can solve problems such as limiting integration and information density

Active Publication Date: 2013-01-02
NINGBO UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement of semiconductor technology, the proportion of the area required for wiring on silicon wafers is increasing, which limits the further improvement of integration and information density.

Method used

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  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve
  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve
  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0032] The design principle of the present invention is: the truth table of the three-valued JKL flip-flop is as shown in Table 1, wherein J , K , L is the input signal, Q and Q ' are the current state and the next state of the flip-flop respectively, d is any value and d ∈ {0, 1, 2}. According to the truth table, the next state of the flip-flop Q ' depends on the input signal J , K , L and status quo Q , so the flip-flop is a typical Mealey-type circuit, the current state Q It needs to pass through the buffer circuit as the input signal of the next working stage.

[0033] Table 1 Truth table of three-valued JKL flip-flop

[0034]

[0035] Since the evaluation circuit of the domino circuit generally only has NMOS tubes or PMOS tubes, the logic 1 signal cannot be directly judged, so the input signal of the three-value JKL flip-f...

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Abstract

The invention discloses a three-valued thermal-insulation domino direct circulation valve and a three-valued thermal-insulation domino reverse circulation valve which respectively comprise a three-valued low-power dissipation domino JKL trigger, wherein each three-valued low-power dissipation domino JKL trigger consists of a first three-valued thermal-insulation domino text calculation circuit, a second three-valued thermal-insulation domino text calculation circuit, a third three-valued thermal-insulation domino text calculation circuit, a fourth three-valued thermal-insulation domino text calculation circuit and a basic three-valued JKL trigger circuit; thermal-insulation logic, multi-valued logic and multi-domino circuits are combined together through the first to fourth three-valued thermal-insulation domino text calculation circuits, thus realizing a three-valued low-power dissipation domino JKL trigger; and the three-valued thermal-insulation domino direct circulation valve and the three-valued thermal-insulation domino reverse circulation valve have the advantages of being high in circuit integration and information density and low in power dissipation on the basis of the three-valued low-power dissipation domino JKL trigger.

Description

technical field [0001] The invention relates to a circulation door, in particular to a three-value adiabatic domino forward circulation door and a reverse circulation door. Background technique [0002] With the continuous progress of semiconductor technology, the proportion of the area required for wiring on silicon wafers is increasing, which limits the further improvement of integration and information density. The use of multi-valued logic can increase the amount of information carried by each connecting line, greatly reducing the number of connecting lines in the circuit, thereby reducing the area of ​​the chip and enhancing the data processing capability. Domino circuits are widely used in high-speed computing circuits and critical paths in processors, registers, and registers due to their excellent characteristics of fast speed and small area. Circuit integration and information density. [0003] The forward and reverse cycle gate circuit is one of the basic modules...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K19/20H03K3/012
Inventor 汪鹏君杨乾坤郑雪松
Owner NINGBO UNIV
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