Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve

A domino and positive cycle technology, applied in the field of cycle doors, can solve problems such as limiting integration and information density

Active Publication Date: 2015-01-14
NINGBO UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement of semiconductor technology, the proportion of the area required for wiring on silicon wafers is increasing, which limits the further improvement of integration and information density.

Method used

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  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve
  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve
  • Three-valued thermal-insulation domino direct circulation valve and reverse circulation valve

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Embodiment Construction

[0031] The present invention will be described in further detail below in conjunction with the embodiments of the drawings.

[0032] The design principle of the present invention is: the three-value JKL flip-flop truth table is shown in Table 1, where J, K, L are input signals, Q and Q′ are the current state and the second state of the flip-flop, and d is any value and d∈{0,1,2}. According to the truth table, the next state Q′ of the flip-flop depends on the input signals J, K, L and the current state Q. Therefore, the flip-flop is a typical Milli-type circuit, and the current state Q needs to pass through the buffer circuit as the next work The input signal of the stage.

[0033] Table 1 Three-value JKL trigger truth table

[0034]

[0035] Because the evaluation circuit of domino circuit generally only has NMOS tube or PMOS tube, it is impossible to directly distinguish the logic 1 signal, so the input signal of the three-value JKL flip-flop must first pass through the three-valu...

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Abstract

The invention discloses a three-valued thermal-insulation domino direct circulation valve and a three-valued thermal-insulation domino reverse circulation valve which respectively comprise a three-valued low-power dissipation domino JKL trigger, wherein each three-valued low-power dissipation domino JKL trigger consists of a first three-valued thermal-insulation domino text calculation circuit, a second three-valued thermal-insulation domino text calculation circuit, a third three-valued thermal-insulation domino text calculation circuit, a fourth three-valued thermal-insulation domino text calculation circuit and a basic three-valued JKL trigger circuit; thermal-insulation logic, multi-valued logic and multi-domino circuits are combined together through the first to fourth three-valued thermal-insulation domino text calculation circuits, thus realizing a three-valued low-power dissipation domino JKL trigger; and the three-valued thermal-insulation domino direct circulation valve and the three-valued thermal-insulation domino reverse circulation valve have the advantages of being high in circuit integration and information density and low in power dissipation on the basis of the three-valued low-power dissipation domino JKL trigger.

Description

Technical field [0001] The invention relates to a circulation door, in particular to a three-value adiabatic domino positive circulation door and a reverse circulation door. Background technique [0002] With the continuous progress of semiconductor technology, the proportion of the area required for wiring on silicon wafers is getting larger and larger, which limits the further improvement of integration and information density. The use of multi-valued logic can increase the amount of information carried by each connection line, greatly reduce the number of connection lines in the circuit, thereby reducing the area of ​​the chip and enhancing the data processing capability. Domino circuits are widely used in high-speed arithmetic circuits and critical paths in processors, registers, and buffers due to their high speed and small area. Therefore, the combination of multi-valued logic and domino circuits can be improved to a greater extent Circuit integration and information densi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F7/72H03K19/20H03K3/012
Inventor 汪鹏君杨乾坤郑雪松
Owner NINGBO UNIV
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