Novel transparent conductive film and preparation method thereof

Abstract

The invention aims to solve the technical problems of overcoming the defects of high resistivity, low ductility and poor adhesion between a conductive layer and a basal body of the transparent conductive film in the prior art and provide a novel transparent conductive film and a preparation method thereof. The novel transparent conductive film comprises the following components in percentage by mass: 25-35 percent of hydrogenated bisphenol A epoxy resin, 22-25 percent of epoxy resin active diluting agent, 0.5-1.5 percent of anti-ultraviolet (UV) additive, 20-30 percent of hydrogenated alicyclic amine, 2.5-4 percent of modified amine type curing promoter and 12-27 percent of conductive filler. The transparent conductive film is low in both surface resistivity and size resistivity, can be made into thin films of different thickness, and has the advantages of high transparency, high conductivity, high adhesion strength and the like; and the preparation method has the advantages of simple preparation method, readily available raw materials and non-severe preparation conditions.

Description

technical field [0001] The invention relates to a method for preparing a thin film with transparent, conductive and bonding functions. Background technique [0002] The transparent conductive adhesive film has good conductivity, high transparency in the visible light wave band, and a film with adhesive function. It is widely used in flat panel displays, thin film solar cells, sensors, touch screens, and stretchable electronics. [0003] The traditional transparent conductive film material is mainly tin-doped indium oxide (ITO). The thickness of the film is generally in the order of tens of nanometers to microns, and it is mainly attached to hard substrates such as glass. Due to the lack and high cost of indium resources, people have developed transparent conductive films based on conductive polymers, conductive nanowires, carbon nanotubes and graphene, and expanded to polyethylene terephthalic acid (PET), polyvinyl alcohol, polyethylene and other flexible substrates, and de...

AI Technical Summary

Problems solved by technology

The above transparent conductive film is mainly characterized by conductive film surface, small thickness of conductive layer, low ductility and low adhesion.

[0005] Existing conductive adhesive films rarely use epoxy resin matrix, because it is difficult to achieve a very soft level, most of them are PET matrix, and the preparation method is to heat the conductive filler to soften the matrix by hot pressing Pressed into the matrix resin, the surface resistivity of the obtained conductive adhesive film meets the requirements, but the volume resistivity is very low

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