LED lamp packaging enclosure structure

Abstract

An LED lamp packaging enclosure structure comprises a base material, a light emitting diode chip and an enclosure, wherein the light emitting diode chip is arranged on the surface of the base material, and the enclosure encircling the light emitting diode chip is arranged on the surface of the base material. A packaging material layer presenting the light emitting diode chip is poured into the inner face encircled by the enclosure. The enclosure is made of silica gel with light-transmitting effect. The LED lamp packaging enclosure structure is made of a light-transmitting material or is provided with a refraction surface, so that the LED is provided with better light diffusing effect or light condensation effect.

Description

technical field [0001] The invention relates to an LED lamp packaging enclosure structure, in particular to an LED lamp packaging enclosure structure made of light-transmitting material, or an LED lamp packaging enclosure structure with a refracting surface, so that the LED has a relatively high performance. Excellent light diffusion or light gathering effect. Background technique [0002] At present, due to the breakthrough of technical bottlenecks such as poor luminous power of traditional LEDs, LEDs can not only be used in the indicator lights or auxiliary lights of general electrical appliances, but also in the field of lighting equipment. Moreover, the current operating current of high-power LEDs can reach more than 2 amps, which is more than 100 times that of traditional LEDs with only 20 mA, and the luminous power of a single high-power LED is greater than the total luminous power of hundreds of traditional LEDs. Therefore, the brightness is quite high, reaching 160 ...

AI Technical Summary

Problems solved by technology

[0003] see Figure 4 As shown, it is an existing LED packaging structure, which includes a substrate 51, a light emitting diode chip 52 and a surrounding body 53, the light emitting diode chip 52 is arranged on the surface of the substrate 51, and the surrounding body 53 presents surrounding light The diode chip 52 is arranged on the surface of the base material 51, and finally the area surrounded by the enclosure 53 is injected into the encapsulation material layer 54 to make it solidify, and then the chip encapsulation of the LED can be completed; however, the existing LED encapsulation structure adopts The surrounding body 53 is a rubber body with a light shielding effect, so that the light irradiated by the light-emitting diode chip 52 on the surrounding body 53 is easily shielded, reducing the lighting efficiency of the LED.

[0004] In view of the fact that the surrounding body 53 made of rubber in the existing LED packaging structure has the disadvantage of reducing the lighting efficiency of the LED, the inventors have proposed a LED lamp packaging surrounding body structure, which is a light-transmitting material. Enclosure structure of LED lamp package, or an enclosure structure of LED lamp package with a refracting surface, so that LED has better light diffusion or light concentrating effect

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