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wafer packaging

A technology of installation location and installation device, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as falling debris, and achieve the effect of reducing risks

Active Publication Date: 2015-07-29
ASM INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when a wafer breaks, debris may still fall through the opening and onto the processing surface of the underlying wafer

Method used

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  • wafer packaging
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Embodiment Construction

[0016] figure 1 An exemplary embodiment of a boat package according to the present invention is illustrated in schematic form. The wafer boat package 1 is intended for use with a batch vertical furnace, shown with a conventional base 2 support consisting of a plurality of heat shields 4 . The wafer boat package 1 mentioned above has a support 10 and a plurality of sub-carriers 20 , which are suspended in the support 10 in a detachable manner. Such as figure 2 As shown, the bracket 10 is also supported by the base 2, but does not contain the sub-carrier 30; Figure 3A The loaded subvector 20 is shown alone in -B. Referring also to these figures below, the construction of the boat package 1 is explained in general terms according to the invention.

[0017] In particular please refer to figure 2 . The support 10 of the wafer boat package 1 may include one or more extending parts, the rods 12 are parallel to each other, and generally extend in a substantially vertical dire...

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Abstract

The invention relates to a wafer boat package which comprises a support frame (10) and a plurality of subcarriers (30), wherein the support frame (10) is provided with a plurality of vertically extending rod pieces (12), and the rod pieces (12) are separated on multiple positions along the lengths of the rod pieces (12) so that a plurality of subcarrier installation positions (16) are limited; the support frame (10) is also provided with at least one fragment collection plate (20), and one of the fragment collection plate (20) is connected to the rod pieces (12) and positioned between any two adjacent subcarrier installation positions (16); each subcarrier (30) is configured to keep a plurality of plane substrates (40) which are basically vertically directed and horizontally separated, and each plane substrate (40) is arranged on each subcarrier installation position (16) of the support frame (10) in a detachable way; and when the subcarriers (30) are arranged in the support frame (10), each fragment collection plate (20) occupies a fragment collection region (22), the fragment collection region (22) extends below the subcarrier (30) arranged on the corresponding subcarrier installation positions (16), and spanning area at least reaches the area of a region occupied by subcarrier (30).

Description

technical field [0001] The present invention relates to the field of semiconductor processing, and more particularly to vertical boat packaging for supporting multiple thin semiconductor wafers. Background technique [0002] Vertical boats are primarily used to provide adequate support for semiconductor wafers as they are processed in a vertical furnace, ideally to minimize local gravitational and thermal stresses on the wafers to avoid slippage and plastic deformation . [0003] Vertical boats typically include three or more vertically extending rods, each defining a plurality of vertically spaced grooves. Three or more grooves on different rods at the same vertical position can determine the wafer holding position so as to support the wafer from the horizontal direction. Thus, a single boat can support multiple horizontally oriented wafers, one pressed against the other. This boat configuration is more common in older technologies and is well suited for supporting 300mm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673
Inventor C·G·M·德里德E·哈尔托赫登-贝斯林克A·加尔森
Owner ASM INTERNATIONAL
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