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Etching and forming method for stainless steel without micro connecting points

A technology of micro-connection and stainless steel, which is applied in the field of stainless steel sheet etching and forming without micro-connection points, can solve the problems of affecting product quality stability, low overall yield rate of graphic steel sheets, and affecting product appearance quality, etc., to overcome the problem of etching after nickel plating puzzle effect

Inactive Publication Date: 2015-05-06
SUZHOU YUNHONG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. Potential burr risk of micro-connection points: When there are slight flaws in the etching of stainless steel, or the manual breaking of micro-connection points is incorrect, there is a potential burr risk at the micro-connection points of the graphic steel sheet
After bonding and curing with FPC, the FPC circuit will be damaged by burrs, resulting in the scrapping of the final product
[0007] 2. Gap of the graphic steel sheet: When the micro-connection point of the graphic steel sheet is broken, there will be a gap, which will affect the appearance quality of the product. For some products with special requirements, the quality stability of the final product will be affected by the gap of the graphic steel sheet
[0008] 3. Waste of man-hours and costs: It takes a lot of manual work to break off the micro-connection points of the single PCS graphic steel sheet before it can be bonded and solidified with FPC. This process will cause huge waste of man-hours and cost, and increase the manufacturing cost
[0009] 4. The nickel plating process reduces the overall yield rate of the graphic steel sheet: the original technology single PCS graphic steel sheet is positioned through micro-connection points, and in the nickel plating process, due to hanger positioning, washing, drying and other processes, the single PCS graphic steel There will be abnormalities such as deformation and falling off of the sheet, resulting in a low overall yield rate of the graphic steel sheet

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The stainless steel micro-junction-free etching forming method of the present invention adopts the following steps sequentially: first etching of stainless steel sheet, positioning of PET carrier, secondary etching of stainless steel sheet, lamination of back glue, lamination and curing of graphic steel sheet + FPC. Before the stainless steel sheet is etched for the first time, it is electroplated with nickel.

[0021] The first etching method of the stainless steel sheet is as follows:

[0022] Use: FeCL 3 +HCL+NaCLO 3 The potion is half-cut, cleaned, and dried, and then positioned with a PET carrier. The etching temperature: 45°C, pressure: 1kg / cm2; potion ratio: FeCL 3 : 300g / L, HCL: 15g / L, NaCLO 3 : 100g / L.

[0023] The secondary etching method of the stainless steel sheet is as follows:

[0024] Use: positioning with PET carrier, using FeCL 3 +HCL+NaCLO 3 The potion performs graphic etching to complete the etching, where the etching temperature: 45°C, pressu...

Embodiment 2

[0027] The stainless steel micro-junction-free etching forming method of the present invention adopts the following steps sequentially: first etching of stainless steel sheet, positioning of PET carrier, secondary etching of stainless steel sheet, lamination of back glue, lamination and curing of graphic steel sheet + FPC. Before the stainless steel sheet is etched for the first time, it is electroplated with nickel.

[0028] The first etching method of the stainless steel sheet is as follows:

[0029] Use: FeCL 3 +HCL+NaCLO 3 The potion is half-cut, cleaned, dried, and then positioned with a PET carrier. The etching temperature: 50°C, pressure: 3kg / cm2; potion ratio: FeCL 3 :350g / L, HCL: 30g / L, NaCLO 3 : 300g / L.

[0030] The secondary etching method of the stainless steel sheet is as follows:

[0031] Use: positioning with PET carrier, using FeCL 3 +HCL+NaCLO 3 The potion performs graphic etching to complete the etching, where the etching temperature: 50°C, pressure: 3...

Embodiment 3

[0034] The stainless steel micro-junction-free etching forming method of the present invention adopts the following steps sequentially: first etching of stainless steel sheet, positioning of PET carrier, secondary etching of stainless steel sheet, lamination of back glue, lamination and curing of graphic steel sheet + FPC. Before the stainless steel sheet is etched for the first time, it is electroplated with nickel.

[0035] The first etching method of the stainless steel sheet is as follows:

[0036] Use: FeCL 3 +HCL+NaCLO 3 The potion is half-cut, cleaned, and dried, and then positioned with a PET carrier. The etching temperature: 55°C, pressure: 6kg / cm2; potion ratio: FeCL 3 : 400g / L, HCL: 45g / L, NaCLO 3 : 400g / L.

[0037] The secondary etching method of the stainless steel sheet is as follows:

[0038] Use: positioning with PET carrier, using FeCL 3 +HCL+NaCLO 3 The potion performs graphic etching to complete the etching, where the etching temperature: 55°C, pressu...

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PUM

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Abstract

The invention discloses an etching and forming method for stainless steel without micro connecting points. The method comprises the following steps of: primarily etching a stainless steel sheet; positioning a PET (Polyethylene Terephthalate) carrier; secondarily etching the stainless steel sheet; attaching gum; and attaching and curing a patterned steel sheet and an FPC (Flexible Printed Circuit). With the adoption of a uniquely created PET carrier positioning plus secondary etching and forming technology, a necessary micro connecting point design in the prior art is overcome, and the difficulty of sequential nickel plating and etching is overcome. The micro connecting points are not needed to break manually for the patterned steel sheet which can be directly attached to and cured with the FPC so as to form a final product.

Description

technical field [0001] The invention relates to a micro-junction-free etching forming method for a stainless steel sheet, in particular to a micro-junction-free etching forming method for an electroplated nickel stainless steel sheet. Background technique [0002] Stainless steel sheet etching technology: use the principle of chemical reaction to corrode and dissolve the non-graphic area of ​​stainless steel sheet, and retain the technology of stainless steel graphic steel sheet. [0003] In the original technology, in order to prevent the graphic steel sheet from falling into the etching groove during the etching forming process, a micro-connection point design is required, as shown in Figure 1, and then the entire etched graphic steel sheet is electroplated with nickel and adhesive, and processed at the client In the process, the micro-connection points of the graphic steel sheet are manually broken, and the final product is formed by laminating and curing with the FPC. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/28C23F1/02
Inventor 马文勇
Owner SUZHOU YUNHONG PLASTIC