Radiator

Abstract

Provided is a radiator. The radiator comprises a heat conduction base and a plurality of first-level radiating strips. Each first radiating strip is arranged on the top face of the heat conduction base and perpendicular to the top face of the heat conduction base. The plurality of first-level radiating strips are arranged along the circumferential direction and surround to form a column-shaped convection channel, a heat convection channel is formed between each two adjacent first-level radiating strips, and each heat convection channel is communicated with the column-shaped convection channel. The radiator can carry out radiation in a heat conduction mode, a heat convection mode and a heat radiation mode at the same time while an existing radiator usually has only one or two radiating modes. The radiator is good in radiating effect, especially suitable for radiation of large-power chips, and capable of saving materials, and therefore cost is reduced.

Description

[0001] technical field [0002] The invention relates to a radiator. [0003] Background technique [0004] COB (chip on board, chip on board) packaged LED lights generally include a COB-packaged LED component, a reflector cover set on the LED component, and a heat sink installed on the back of the base of the LED component. Among them, the heat sink generally includes a cylindrical heat-conducting shell and a number of heat-dissipating fins evenly arranged outside the side wall of the heat-conducting shell. When the heat sink with this structure is installed on the back of the base of the LED component, the chips of the LED component The cavity of the quasi-heat-conducting shell, that is, the cavity of the heat-conducting body aligned with the middle of the base. The heat of the base gradually decreases from the center of the chip to the outer edge, that is to say, the heat in the middle of the base is the highest, but because the cavity of the heat conduction shell is a ...

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