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adhesive tape

An adhesive tape and adhesive layer technology, applied in the direction of adhesives, film/sheet adhesives, electrical components, etc., can solve the problem that the adhesive tape cannot fully fill the pattern surface of the semiconductor wafer, and the pressure of the semiconductor wafer is insufficient Problems such as uniformity and inability to grind smoothly

Inactive Publication Date: 2015-09-02
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such conventional adhesive tapes cannot sufficiently fill the irregularities on the pattern surface of the semiconductor wafer, or even after filling them immediately after pasting, the adhesive tape floats over time, and as a result, it is used in the back grinding process. However, it still cannot fully fill the unevenness of the pattern surface
In this way, if the pattern surface of the semiconductor wafer cannot be fully filled, the following problems will occur: the pressure applied to the semiconductor wafer during grinding becomes uneven, and the unevenness of the pattern surface of the semiconductor wafer affects the back surface, resulting in non-smoothness. Grinding problems, or cracks in semiconductor wafers

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0064] As an adhesive layer forming material, an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "TAFTHREN H5002": structural unit derived from propylene 90 mol% / 1-butene-derived structural unit 10 mol%, Mw=230000, Mw / Mn=1.8).

[0065] As the substrate layer forming material, ethylene-vinyl acetate copolymer (EVA) (manufactured by DU PONT-MISUI CO., LTD., trade name "EVAFLEX P-1007") was used.

[0066] The above-mentioned binder forming material and substrate layer forming material were charged into respective extruders, and T-die melt coextrusion was carried out (extruder: manufactured by GM ENGINEERING, Inc., trade name "GM30-28" / T die: Feed block (feed block) method, extrusion temperature: 180 ° C), the resin in the molten state and the Si-coated PET separator (manufactured by Mitsubishi Chemical Corporation, trade name "Diafoil MRF") passed to the touch roll forming part of the paper ,...

Embodiment 2

[0068] As an adhesive layer forming material, 80 parts of an amorphous propylene-(1-butene) copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name "TAFTHREN H5002") propylene-derived structural unit polymerized by a metallocene catalyst was used. 90 mol% / 10 mol% of structural units derived from 1-butene, Mw=230000, Mw / Mn=1.8) and 20 parts of crystalline polypropylene-based resin (manufactured by Japan Polypropylene Corp., Trade name "WINTEC WFX4", Mw=363000, Mw / Mn=2.87) mixture.

[0069] As the substrate layer forming material, an ethylene-vinyl acetate copolymer (manufactured by DU PONT-MISUI CO., LTD., trade name "EVAFLEX P-1007") was used.

[0070] The above-mentioned binder forming material and substrate layer forming material were charged into respective extruders, and T-die melt coextrusion was carried out (extruder: manufactured by GM ENGINEERING, Inc., trade name "GM30-28" / T die: Feed block (feed block) method, extrusion temperature: 180 ° C), the resin in...

Embodiment 3

[0072] In addition to setting the blending amount of the amorphous propylene-(1-butene) copolymer to 60 parts instead of 80 parts, and setting the blending amount of the crystalline polypropylene resin to 40 parts instead of 20 parts, in addition, In the same manner as in Example 2, an adhesive tape was obtained.

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Abstract

The present invention provides an adhesive tape which has level difference followability capable of sufficiently filling up irregularities of an adherend and which can maintain a state in which the irregularities are sufficiently filled over time. The adhesive tape of the present invention has an adhesive layer and a substrate layer, the storage modulus of the adhesive layer at 20°C is 0.5×106Pa~1.0×108Pa, and the adhesive layer has a storage modulus of 0.5×106Pa~1.0×108Pa at 20°C~80°C The lower loss tangent tanδ is 0.1 or more. In a preferred embodiment, the aforementioned adhesive layer comprises an amorphous propylene-(1-butene) copolymer polymerized using a metallocene catalyst, and the weight average molecular weight of the propylene-(1-butene) copolymer is (Mw) is 200,000 or more, and the molecular weight distribution (Mw / Mn) of the propylene-(1-butene) copolymer is 2 or less.

Description

technical field [0001] This invention relates to adhesive tapes. Background technique [0002] Semiconductor wafers made of silicon, gallium, arsenic, etc. are produced in a state of large diameter, patterned on the surface, and then the back surface is ground, and the thickness of the wafer is usually reduced to about 100 to 600 μm, and then cut and separated (dicing) into Small pieces of components are further transferred to the mounting process. [0003] In the process of grinding the back surface of the semiconductor wafer (back grinding process), an adhesive tape is used to protect the surface (pattern surface) of the semiconductor wafer. The adhesive tape is usually peeled off after the back grinding process. The adhesive tape used for this purpose requires a level of adhesive strength that does not peel off during the back grinding process, and on the other hand, requires a level that can be easily peeled off without damaging the semiconductor wafer after the back g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C08F210/08C09J123/14C09J201/00C09J7/22C09J7/38
CPCC09J123/14C09J2203/326C09J2423/00H01L21/6836H01L2221/68327H01L2221/6834C09J7/38C09J7/22
Inventor 佐佐木贵俊土生刚志生岛伸祐龟井胜利浅井文辉
Owner NITTO DENKO CORP