Electronic device and manufacturing method thereof

Abstract

The embodiment of the invention provides an electronic device and a manufacturing method thereof. The electronic device comprises a substrate, which is provided with a grounding layer; a first electronic element and a second electronic element, which are disposed on the substrate; a metal shielding wall, which is disposed between the first electronic element and the second element; a plastic sealing rubber, which can be used to wrap the first electronic element, the second electronic element, and the metal shielding wall, and is provided with an opening; a conductive film, which is used to wrap a metal surface exposed from the opening of the metal surface of the top of the metal shielding wall, and is electrically connected with the grounding layer of the substrate. The electronic device and the manufacturing method thereof have advantages of better electromagnetic interference shielding effect, and ability of saving electromagnetic interference shielding packaging costs of electronic elements.

Description

technical field [0001] Embodiments of the present invention relate to electromagnetic interference shielding technologies, and in particular to an electronic device and a method for manufacturing the electronic device. Background technique [0002] The electromagnetic interference shielding design can reduce the external radiation interference of electronic components, and can also reduce the interference of external radiation on electronic components. Many electronic components require electromagnetic interference shielding design. For example, in IC design, it is necessary to separate the radio frequency electronic components from the surrounding electronic components. [0003] In the prior art, a commonly used shielding method for electronic components is mainly to realize the shielding of electronic components through a metal shielding frame. [0004] figure 1 It is a schematic structural diagram of a metal shielding frame in the prior art, such as figure 1 As shown, ...

AI Technical Summary

Problems solved by technology

However, the metal shielding frame 101 increases the overall height of the plastic package module, and the plastic sealant can only penetrate into the metal shield frame 101 through the through hole 102 on the metal shield frame 101, and the fluidity of the plastic sealant is poor.

Therefore, the effect of shielding electronic components through metal shielding frames is not good

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