A kind of preparation method of polymer flexible conductive film

A polymer film, flexible conductive technology, used in printed circuit manufacturing, printed circuits, electrical components and other directions, can solve the problems of complex manufacturing process, damage to electronic equipment, reduce the breakdown voltage tolerance of circuit boards, etc. The effect of folding, eliminating internal stress, enhancing voltage breakdown performance

Active Publication Date: 2020-02-14
HUNAN UNIV OF ARTS & SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The manufacturing process of FPC products currently on the market is complex. Affected by the properties of polymer matrix materials, chemical etching is often used, and then the metal plate material layer is laminated to form a multi-layer composite material. This structure is very important for FPC in foldable When used in electronic equipment, due to repeated folding, it not only reduces the breakdown voltage tolerance of the circuit board, but also makes it easier to delaminate the multilayer structure, forming an open circuit of the electronic circuit, thus damaging the electronic equipment

Method used

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  • A kind of preparation method of polymer flexible conductive film

Examples

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Effect test

Embodiment 1

[0026] A preparation method of polymer flexible conductive film:

[0027] (1) Roughen the PP film with a thickness of 1um in lye solution (60% by weight of sodium hydroxide, 40% by weight of ethylene glycol) for 30 minutes at 60°C, wash and dry it;

[0028] (2) Carry out heat-bonding laser pattern etching to the polymer film processed through step (1),

[0029] The laser power is 20Kw, the laser beam width is 0.4um, the etching speed is 15mm / min, the etching depth is 1 / 3 of the thickness of the substrate, and the heat treatment temperature of the whole film is 180℃ while the laser is in use;

[0030] (3) Brush the strongly acidic mixed solution of ferrous chloride and ferrous sulfate (ferrous ion concentration is 7mol / L) in the lines obtained in step (2), and after drying, immerse the polymer film in 0.5mol / L Fully soak in the silver nitrate solution of L, so that the etched texture surface of the polymer film is covered with a 0.1um conductive layer;

[0031] (4) on the con...

Embodiment 2

[0035] A preparation method of polymer flexible conductive film:

[0036] (1) Roughen the PE film with a thickness of 5um in lye solution (70% by weight of sodium hydroxide, 30% by weight of ethylene glycol) for 40 minutes at 70°C, wash and dry it;

[0037] (2) Carry out heat-bonding laser pattern etching to the polymer film processed through step (1),

[0038] The laser power is 20Kw, the laser beam width is 0.4um, the etching speed is 15mm / min, the etching depth is 1 / 3 of the thickness of the substrate, and the heat treatment temperature of the whole film is 180℃ while the laser is in use;

[0039] (3) Brush the strongly acidic mixed solution of ferrous chloride and ferrous sulfate (the ferrous ion concentration is 6mol / L) in the lines obtained in step (2), and after drying, immerse the polymer film in 0.2mol / L Fully soak in the silver nitrate solution of L, so that the etched texture surface of the polymer film is covered with a 0.3um conductive layer;

[0040] (4) on the...

Embodiment 3

[0044] A preparation method of polymer flexible conductive film:

[0045] (1) Roughen the PVC film with a thickness of 8um in lye solution (80% by weight of sodium hydroxide, 20% by weight of ethylene glycol) for 60 minutes at 80°C, clean and dry;

[0046] (2) Carry out heat-bonding laser pattern etching to the polymer film processed through step (1),

[0047] The laser power is 20Kw, the width of the laser beam is 0.4um, the etching speed is 15mm / min, the etching depth is 2 / 3 of the thickness of the substrate, and the heat treatment temperature of the whole film is 180℃ while the laser is in use;

[0048] (3) Brush the strongly acidic mixed solution of ferrous chloride and ferrous sulfate (the ferrous ion concentration is 10mol / L) in the lines obtained in step (2), and after drying, immerse the polymer film in 0.5mol / L Fully soak in the silver nitrate solution of L, so that the etched texture surface of the polymer film is covered with a 0.6um conductive layer;

[0049](4) ...

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Abstract

The invention belongs to the field of preparation of polymer materials applied to circuit boards and particularly relates to a preparation method of a flexible polymer conductive film. The method comprises the following steps of carrying out roughening treatment on a polymer film in a strong alkaline solution; carrying out thermal sealing laser line etching to form required electronic lines; carrying out oxidation reduction process in the lines of the polymer film subjected to laser etching to form a conductive layer on the surfaces of the lines; carrying out graded electroplating, laminatinga metal copper layer and then laminating a metal copper-nickel-tin alloy layer on the surface of the metal copper layer; and finally carrying out pore repair process treatment and thermal treatment.

Description

technical field [0001] The invention belongs to the field of polymer material preparation applied to circuit boards, in particular to a method for preparing a polymer flexible conductive film. Background technique [0002] In mobile terminal products, flexible printed circuit boards (Flexible Printed Circuit, referred to as FPC) are widely used in the electrical connection between modules and printed circuit boards (Printed Circuit Board, referred to as PCB), such as camera modules with FPC, LCD Display mods and more. FPC has the characteristics of thin thickness, light weight, and bendability, and is widely used in electronic products. [0003] The manufacturing process of FPC products currently on the market is complicated. Affected by the properties of the polymer matrix material, chemical etching is often used, and then the metal plate material layer is laminated to form a multi-layer composite material. This structure is suitable for FPC in foldable When used in elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18H05K3/38
CPCH05K3/18H05K3/381H05K2203/107
Inventor 申有名张春香戴灵聪彭新菊彭珍谢滢婷
Owner HUNAN UNIV OF ARTS & SCI
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