Electronic device and electronic device manufacturing method

A technology of electronic devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor/solid-state device components, etc., can solve the problems of poor fluidity of plastic sealant, increased height, and poor effect of electronic components, etc., to achieve Occupies a small space on the substrate, saves packaging costs, and saves the cost of electromagnetic interference shielding and packaging

Active Publication Date: 2016-05-25
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal shielding frame 101 increases the overall height of the plastic package module, and the plastic sealant can only penetrate into the metal shield frame 101 through the through hole 102 on the metal shield frame 101, and the fluidity of the plastic sealant is poor.
Therefore, the effect of shielding electronic components through metal shielding frames is not good

Method used

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  • Electronic device and electronic device manufacturing method
  • Electronic device and electronic device manufacturing method
  • Electronic device and electronic device manufacturing method

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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention. rather than all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] figure 2 The schematic diagram of the cross-sectional structure of the electronic device provided by the embodiment of the present invention, such as figure 2 As shown, the electronic device includes a substrate 201 , a first electronic component 202 , a second electronic component 203 , a metal shielding wall 204 , a plastic sealant 205 and a conductive film 206 .

[0039] A gr...

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PUM

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Abstract

Provided are an electronic device and a manufacturing method thereof. An electronic device comprises a base plate (201), with a ground layer provided in the base plate (201); a first electronic element (202) and a second electronic element (203) provided on the base plate (201); a metallic shield wall (204) provided between the first electronic element (202) and the second electronic element (203); a plastic packaging glue (205) covering the first electronic element (202), the second electronic element (203) and the metallic shield wall (204), wherein there is an opening on the plastic packaging glue (205) and only the metallic face on the top of the shield wall (204) is exposed from the opening; and a conductive thin film (206) covering the metallic face on the top of the shield wall (204) and the plastic packaging glue (205), and being electrically connected to the ground layer of the base plate (201). The electronic device and the manufacturing method thereof can provide a better effect for shielding electromagnetic interference and save packaging costs for shielding an electronic device from electromagnetic interference.

Description

technical field [0001] Embodiments of the present invention relate to electromagnetic interference shielding technologies, and in particular to an electronic device and a method for manufacturing the electronic device. Background technique [0002] The electromagnetic interference shielding design can reduce the external radiation interference of electronic components, and can also reduce the interference of external radiation on electronic components. Many electronic components require electromagnetic interference shielding design. For example, in IC design, it is necessary to separate the radio frequency electronic components from the surrounding electronic components. [0003] In the prior art, a commonly used shielding method for electronic components is mainly to realize the shielding of electronic components through a metal shielding frame. [0004] figure 1 It is a schematic structural diagram of a metal shielding frame in the prior art, such as figure 1 As shown, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552H01L23/31H01L21/56
CPCH01L23/552H01L23/3121H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/19105H01L2924/3025
Inventor 杨宇占奇志
Owner HUAWEI DEVICE CO LTD
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