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Automatic classification method and system for failure information of CIS (contact image sensor)

An image sensor and failure information technology, applied in the direction of instruments, special data processing applications, electrical digital data processing, etc., can solve the problems of low efficiency and inaccuracy in statistics and classification, so as to avoid low efficiency and inaccuracy problems, improve Production efficiency and the effect of automatic classification analysis

Active Publication Date: 2014-07-16
中芯国际集成电路制造(深圳)有限公司 +1
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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a method and system for automatically classifying failure information of CIS image sensors, which is used to solve the problem of manual statistics and classification of failure information of CIS image sensors in the prior art. The inefficiency and imprecision of the

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  • Automatic classification method and system for failure information of CIS (contact image sensor)
  • Automatic classification method and system for failure information of CIS (contact image sensor)

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Embodiment

[0047] This embodiment provides a method for automatically classifying failure information of a CIS image sensor, such as figure 2 As shown, the automatic classification method includes:

[0048] The CIS image sensor outputs a picture file of the detection result. Further, the detection result picture file is a BMP (abbreviation for bitMap) picture file, and may also be other types of picture files. BMP is an integration of pixels with a certain width and height, including 2-color bitmap, 16-color bitmap, 256-color bitmap and 24-bit bitmap. Semiconductor testing equipment generally outputs a black and white image of a 256-color bitmap. Observe with the naked eye, it can be found that where there is a failure bit, it will display a darker color with different gray levels, and other places will display a whiter color with different gray levels. , see figure 1 shown.

[0049] Interpret the test result picture file and extract failure information. The specific process include...

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Abstract

The invention provides an automatic classification method and system for failure information of a CIS (contact image sensor). The automatic classification method includes the steps: outputting a detection result picture file which is a BMP (bitmap) picture file by the CIS; reading the detection result picture file and extracting the failure information. The specific process includes: switching the BMP picture file into a hexadecimal file; finding the gray value range of failure bits by a hierarchical cluster analysis method according to the characteristic of pixel color jump of normal bits and the failure bits; switching the failure information into a result file in a standard text format; automatically classifying the failure information in the result file according to a user-defined failure mode; displaying an automatic classification result. The problem of difficulty in automatic classification analysis for CIS product image testing results is rapidly solved, and the problems of low efficiency and inaccuracy of statistics and classification manually performed with eyes for a long time are avoided.

Description

technical field [0001] The invention belongs to the technical field of semiconductor detection, and relates to a method and system for automatically classifying failure information of a CIS image sensor. Background technique [0002] With the development of mobile phone cameras, CMOS image sensors are changing with each passing day. From 20K pixels in the early years to 32M pixels now, different companies, universities, and research institutions around the world are constantly developing CMOS image sensors, and new technologies are produced every year. With the continuous reduction of pixel design, it poses new challenges to the production process and quality of CMOS image sensors. In order to ensure the quality of the product, each image sensor needs to be tested and inspected, and the corresponding BMP picture can be obtained. From the BMP picture, the graphic characteristics of various failure modes on the problematic product can be seen. [0003] In order to obtain inf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/30G06K9/46G06K9/62
CPCG06F18/23G06F18/241
Inventor 康栋林光启
Owner 中芯国际集成电路制造(深圳)有限公司
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