Enhanced heat abstractor employing pulsating flow and foam metal plate

Abstract

The invention discloses an enhanced heat abstractor employing pulsating flow and a foam metal plate. The enhanced heat abstractor comprises a pulsating pump, a heat sink chamber, an accumulated liquid cavity and a cooler, wherein the pulsating pump conveys a cooling liquid into the accumulated liquid cavity through a liquid inflow pipe; the accumulated liquid cavity sprays the cooling liquid into the heat sink chamber; the heat sink chamber conveys the liquid which is subjected to heat transfer into the cooler to cool through a liquid discharge pipe; the pulsating pump sucks in the cooled cooling liquid from the cooler through a connecting pipe; the heat sink chamber comprises the foam metal plate, a heat transfer support plate and a cover board; the heat transfer support plate is connected with a high-heating flux device; the foam metal plate is fixedly connected with the heat transfer support plate; and a dispenser is vertically connected with the top of the cover board. The pulsating flow of the enhanced heat abstractor is matched with a dual-layer foam metal structure, so that transverse and longitudinal disturbance and mixing of working mediums can be increased; a thermal boundary layer is continuously recombined; and meanwhile, cavitation and vortex formation are caused by pressure change in the disturbance process, therefore, the heat transfer efficiency can be greatly improved.

Description

technical field [0001] The invention relates to a heat dissipation device enhanced by adopting pulsating flow and a foam metal plate, which belongs to the field of industrial heat dissipation. Background technique [0002] In recent years, due to the rapid development of industry, the requirements for heat dissipation and heat exchange of electronic equipment have become higher and higher, and the heating power has exceeded 100W / cm 2 . According to the current research, the heat dissipation of electronic chips mainly adopts air cooling, liquid cooling, heat pipes and microchannels. The air-cooled heat dissipation method is difficult to meet the challenges of high heat flux density devices; the heat pipe heat dissipation module is limited by phenomena such as the carrying limit and the dry limit; for liquid cooling and heat dissipation, it is generally carried out under steady-state conditions. Contents of the invention [0003] Purpose of the invention: In order to overc...

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Problems solved by technology

The air-cooled heat dissipation method is difficult to cope with the challenges of high heat flux density devices; the heat pipe heat dissipation module is limited by phenomena such as the carrying limit and the dry limit; for liquid cooling heat dissipation, it is generally carried out under steady-state conditions

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