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Wafer Level Stepped Sensor Holder

An image sensor and ladder technology, applied in the field of image sensors, can solve the problems of increasing the cost and time of producing camera modules, etc.

Active Publication Date: 2018-08-28
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the number of steps required to assemble the camera module increases, the time required to assemble the camera module increases, which increases the cost of producing the camera module

Method used

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  • Wafer Level Stepped Sensor Holder
  • Wafer Level Stepped Sensor Holder
  • Wafer Level Stepped Sensor Holder

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Embodiment Construction

[0011] As will be shown, disclosed are methods and apparatus for providing a wafer-level camera module including a lens stack having a spacer with thinned walls defining a step and a recess to accept an image sensor in accordance with the teachings of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the specific details need not be employed to practice the present invention. In other instances, well-known materials or methods have not been described in detail in order not to obscure the present invention.

[0012] Reference throughout this specification to "one embodiment," "an embodiment," "an example," or "an example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in the present specification. In at least one embodiment ...

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PUM

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Abstract

The present application relates to a wafer level stepped sensor holder. In particular, the invention relates to a device comprising an image sensor bonded to a spacer. The spacer has a thinned wall defining a step and a recess in an interior wall at a first end of the spacer. The image sensor is engaged to the step within the recess of the spacer such that the image sensor is fully received within the recess of the spacer. A glass wafer is mounted on the second end of the spacer. A lens is mounted on the glass wafer such that light is directed to the image sensor through the lens.

Description

technical field [0001] The present invention generally relates to image sensors. More specifically, embodiments of the present invention relate to wafer level camera modules. Background technique [0002] A wafer-scale camera module is a camera module that has a small footprint and can be used in applications such as, for example, mobile phones, notebook computers, tablet computers, and the like. A wafer-level camera module includes optics to focus an image and an image sensor to sense the image. In order to capture high quality images, the optics of a camera module typically include several lenses separated by glass wafers and / or spacers. The lenses are stacked into a lens stack. The lens stack is arranged on the image sensor module. The lens stack and the image sensor module are enclosed within a cylinder that may also be referred to as a holder. [0003] Efforts have been made to reduce camera module size and production costs for the manufacture and assembly of wafer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH04N23/57H04N23/55
Inventor 万宗玮邓兆展陈伟平
Owner OMNIVISION TECH INC