Check patentability & draft patents in minutes with Patsnap Eureka AI!

Chip electronic device and board for mounting chip electronic device

An electronic device, chip technology, applied in the direction of printed circuits, inductors, electrical components connected to non-printed electrical components, and can solve problems such as uneven cross-sectional area of ​​coils

Active Publication Date: 2017-09-01
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the formation technique of a coil of a chip electronic device using the anisotropic plating method in the related art, as far as the outermost coil is concerned, growth in the width direction may also occur, so that the coil may have uneven cross-sectional area

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip electronic device and board for mounting chip electronic device
  • Chip electronic device and board for mounting chip electronic device
  • Chip electronic device and board for mounting chip electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0087] According to another exemplary embodiment of the present invention, the chip electronic device may include: a magnet 50 including an insulating substrate 23 and coil wire patterns 42 and 44 formed on at least one surface of the insulating substrate 23; and an external Electrodes 31 and 32 , external electrodes 31 and 32 are formed on both ends of the magnet 50 to be connected to ends of the coil wire patterns 42 and 44 . The coil wire model 42 may include a model plating layer 42a, a plating layer 42b formed on the model plating layer 42a, and an anisotropic plating layer 42c formed on the plating layer 42b. In the cross section of the magnet 50 along the length-thickness direction, when the left side width and When the right side widths are defined as Wa and Wb respectively, the ratio of Wa:Wb can be 0.1:20 to 0.1:30.

[0088] The width of the model plating of the outermost coil wire model may be greater than the width of the model plating of the inner coil wire model...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a chip electronic component which includes: a magnetic material main body comprising an insulating substrate, and a coil conductive pattern formed at least one surface of the insulating substrate; and an external electrode formed on both end units of the magnetic material main body to be connected to an end unit of the coil conductive pattern. The coil conductive pattern is formed by metal plating. In a cross section of the magnetic material main body in a longitudinal direction, a ratio of an outermost coil conductive pattern compared to an inner coil conductive pattern of the coil conductive pattern satisfies 1.0 to 1.5.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2014-0066925 filed with the Korean Intellectual Property Office on Jun. 2, 2014, the contents of which are hereby incorporated by reference. Background technique [0003] The present invention relates to chip electronic devices and boards for mounting chip electronic devices. [0004] As a chip electronic device, an inductor is a typical passive component, which is configured together with a resistor and a capacitor into a noise-canceling electronic circuit. Inductors and capacitors are combined using electromagnetic properties to configure resonance circuits, filter circuits, etc. that amplify signals within a specific frequency band. [0005] Recently, with the acceleration of miniaturization and thinning of information technology (IT) equipment (eg, various communication equipment, display equipment, etc.), various elements (eg, inductors, Capac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/30H05K1/18
CPCH01F17/0013H01F27/28H05K1/18
Inventor 房惠民郑汀爀金珆暎车慧娫
Owner SAMSUNG ELECTRO MECHANICS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com