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A kind of stacking method of pcb and pcb

A reference layer and back-drilling technology, applied in the electronic field, can solve problems such as serious impact

Active Publication Date: 2018-06-08
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But if it is above 6.9Gpbs, the impact will be very serious
Especially the current rate often exceeds this value; therefore, how to reduce the PCB stacking method that the length of the VIA-Stub affects the high-speed signal is a technical problem that those skilled in the art need to solve

Method used

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  • A kind of stacking method of pcb and pcb
  • A kind of stacking method of pcb and pcb
  • A kind of stacking method of pcb and pcb

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Embodiment Construction

[0026] The core of the present invention is to provide a PCB stacking method and PCB, the method can adjust different stacking to meet the requirement of VIA-stub length corresponding to the corresponding rate.

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] Please refer to figure 1 , figure 1 A flow chart of the PCB stacking method provided by the embodiment of the present inve...

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Abstract

The invention discloses a lamination method of a PCB, and a PCB. The method comprises the following steps: according to a designed maximum transmission rate of PCB signals, obtaining a maximum length of VIA-Stub through calculation; according to the thickness of the PCB and a layer of wiring, selecting the length of longest VIA-Stub; according to a maximum through hole length required by a pressing stress requirement of a crimp connector, determining the through hole length after backdrilling; subtracting the length of the longest VIA-Stub from the through hole length after the backdrilling to obtain an effective transmission length of a hole; and according to the thickness of a medium material, the length of the longest VIA-Stub, the effective transmission length of the hole and a backdrilling length, determining the thickness of each layer in the VIA-Stub, the thickness of each layer corresponding to the effective transmission length of the hole and the thickness of each layer corresponding to the bakdrilling length. The method provided by the invention can adjust different lamination so as to satisfy the requirement for the length of the VIA-Stub corresponding to a corresponding rate.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a PCB stacking method and the PCB. Background technique [0002] With the continuous improvement of the speed, there are more and more problems affecting the signal quality. Among them, the impact is more serious and the focus of this article is the impact and solution of VIA-Stub. Most of the current high-speed connectors are crimp connectors. The crimping connector has the requirement of crimping hard force, therefore, the crimping connector has certain requirements on the depth of the back drilling of the PCB board. If the layer where the high-speed signal line is located is close to the layer where the connector is located, the transmission line is laid on the third layer, and the VIA-Stub of the signal is 87.2mil. If it is back-drilled, it will also take into account the hard force requirements of the connector. The deepest back-drilled Break the seventh layer, so the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/0005H05K3/4611H05K2203/061H05K2203/163
Inventor 宗艳艳贡维
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND