Integrated Hall magnetic sensor packaging stress compensation circuit and method

A technology of packaging stress and compensation circuits, which is applied in the field of sensors, can solve problems such as unsatisfactory compensation effects, and achieve the effects of eliminating the influence of magnetic field sensitivity, easy implementation, and low power consumption

Active Publication Date: 2016-05-25
NANJING UNIV OF POSTS & TELECOMM
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  • Abstract
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  • Claims
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Problems solved by technology

This method is easy to operate and does not need to introduce complex circuits, but its disadvant

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  • Integrated Hall magnetic sensor packaging stress compensation circuit and method
  • Integrated Hall magnetic sensor packaging stress compensation circuit and method
  • Integrated Hall magnetic sensor packaging stress compensation circuit and method

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Embodiment Construction

[0021] The invention will be described in further detail below in conjunction with the accompanying drawings.

[0022] Such as figure 1 As shown, the present invention proposes a packaging stress compensation circuit based on analog signal technology for the influence of the piezoelectric effect produced by the packaging stress of the integrated Hall sensor on the sensitivity of the Hall plate magnetic field. The circuit includes a stress detection circuit, a bias circuit and stress compensation circuit. The stress detection circuit includes a stress sensor, a differential-differential amplifier (DDA) and an analog-to-digital converter (ADC). The bias circuit includes three parts: reference current, mirror current source, and proportional micro-current source. The stress sensor and the Hall sensor are integrated on the same chip to generate a weak electrical signal proportional to the package stress, and the offset compensation voltage V of the stress sensor off It is trans...

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Abstract

The invention discloses an integrated Hall magnetic sensor packaging stress compensation circuit and method. The integral circuit comprises a stress detection circuit, a bias circuit and a stress compensation circuit. The stress detection circuit comprises three circuit portions, i.e., a stress sensor, a differential-difference amplifier (DDA) and an analog-to-digital converter (ADC). The bias circuit comprises three portions, i.e., a reference current portion, an image current source and a proportion micro current source. The bias circuit and a Hall sensor are integrated to the stress sensor of the same chip, weak electric signals proportional to packaging stress are generated, the electric signals are transmitted to the DDA together with imbalance compensation voltages Voff of the stress sensor and are input to the ADC for analog-to-digital conversion of the signals after being amplified by the DDA, converted digital signals are accessed to the stress compensation circuit, the size and polarity of stress compensation currents are controlled, generated stress compensation currents and bias current I0 are input to a Hall device together, and currents generated by stress in the Hall device are finally eliminated.

Description

technical field [0001] The invention relates to a circuit and method for compensating and eliminating packaging stress of an integrated Hall magnetic sensor, belonging to the technical field of sensors. Background technique [0002] The Hall sensor is a magnetoelectric conversion element based on the Hall effect. With its simple process, small size, low production cost, easy installation, wide operating voltage range, long service life, high measurement accuracy, dust-proof, oil-proof, etc. Advantages, has been widely used in industrial frequency conversion control, transportation, medical systems, consumer electronics and various smart instruments and other fields. [0003] However, due to many reasons, the Hall sensor will be affected by the stress and eventually the performance of the sensor will change significantly. For example: in the wafer manufacturing process, packaging process, the process of soldering the package chip to the circuit board, the injection molding p...

Claims

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Application Information

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IPC IPC(8): G01R33/07G01L1/22
CPCG01L1/2262G01R33/07
Inventor 徐跃徐俊
Owner NANJING UNIV OF POSTS & TELECOMM
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