Method and device for manufacturing a liquid metal multilayer circuit

Abstract

The invention relates to the manufacturing technical field of a flexible circuit, and particularly to a manufacturing method and apparatus for a liquid metal multilayer circuit. According to the manufacturing method and apparatus for the liquid metal multilayer circuit, the circuit can be printed and packaged in different layers; after the circuits in different layers are registered and aligned through a registering mechanism, the packaging materials among the circuits in different layers are fused through a fusion mechanism; the circuits in different layers are punched and connected through a punching mechanism according to requirements; the problem of frequent damage to circuits caused by directly turning over or stacking the liquid metal circuit is avoided; the multilayer liquid metal circuit can be manufactured accurately and effectively, so that the applicable range of the liquid metal circuit is greatly expanded; the packaging thickness, the alignment precision, and the punching accuracy can be effectively ensured; the problems of circuit mismatch, wrong connections, or punched circuits due to carelessness, and the like are avoided; and in addition, the manufacturing method is simple to use, and the manufacturing apparatus has the advantages of simple assembling, low cost, no pollution, and the like.

Description

technical field [0001] The invention relates to the technical field of flexible circuit manufacturing, in particular to a method and device for manufacturing a liquid metal multilayer circuit. Background technique [0002] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metals have made direct writing, printing and other circuit direct printing technologies possible. In the existing liquid metal direct writing and printing, the liquid metal ink infiltrates and adheres to the surface of the organic polymer substrate to realize the printing of conductive lines. However, if the base material is turned over before packaging, it is easy to damage the previously printed circuit. Therefore, after the single-sided circuit is printed, it is difficult to directly print the circuit on the reverse side of the base material, and it is also impossible to directly print the two-sided circuit. Or multiple circuits are directly stac...

AI Technical Summary

Problems solved by technology

However, if the base material is turned over before packaging, it is easy to damage the previously printed circuit. Therefore, after the single-sided circuit is printed, it is difficult to directly print the circuit on the reverse side of the base material, and it is also impossible to directly print the two-sided circuit. Or multiple circuits are directly stacked, thus making the processing of double-sided or multi-layer liquid metal circuits a challenge

Images