Manufacturing method and apparatus for liquid metal multilayer circuit

A technology of liquid metal and multi-layer circuits, applied in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve the problems of printed circuits, the inability to stack two or more circuits directly, and easily damaged circuits, etc., to achieve Avoid circuit misalignment, improve the scope of application, and reduce the cost

Active Publication Date: 2016-05-25
BEIJING DREAM INK TECH CO LTD
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the base material is turned over before packaging, it is easy to damage the previously printed circuit. Therefore, after the single-sided circuit is printed, it is difficult to directly print the circuit on the reverse side of the base material, and it is also impossible to directly print the two-sided circuit. Or multiple circuits are directly stacked, thus making the processing of double-sided or multi-layer liquid metal circuits a challenge

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method and apparatus for liquid metal multilayer circuit
  • Manufacturing method and apparatus for liquid metal multilayer circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

[0042] In the description of the present invention, unless otherwise specified, "plurality" means two or more. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" etc. is Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood To limit the present invention.

[0043] In the description ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the manufacturing technical field of a flexible circuit, and particularly to a manufacturing method and apparatus for a liquid metal multilayer circuit. According to the manufacturing method and apparatus for the liquid metal multilayer circuit, the circuit can be printed and packaged in different layers; after the circuits in different layers are registered and aligned through a registering mechanism, the packaging materials among the circuits in different layers are fused through a fusion mechanism; the circuits in different layers are punched and connected through a punching mechanism according to requirements; the problem of frequent damage to circuits caused by directly turning over or stacking the liquid metal circuit is avoided; the multilayer liquid metal circuit can be manufactured accurately and effectively, so that the applicable range of the liquid metal circuit is greatly expanded; the packaging thickness, the alignment precision, and the punching accuracy can be effectively ensured; the problems of circuit mismatch, wrong connections, or punched circuits due to carelessness, and the like are avoided; and in addition, the manufacturing method is simple to use, and the manufacturing apparatus has the advantages of simple assembling, low cost, no pollution, and the like.

Description

technical field [0001] The invention relates to the technical field of flexible circuit manufacturing, in particular to a method and device for manufacturing a liquid metal multilayer circuit. Background technique [0002] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metals have made direct writing, printing and other circuit direct printing technologies possible. In the existing liquid metal direct writing and printing, the liquid metal ink infiltrates and adheres to the surface of the organic polymer substrate to realize the printing of conductive lines. However, if the base material is turned over before packaging, it is easy to damage the previously printed circuit. Therefore, after the single-sided circuit is printed, it is difficult to directly print the circuit on the reverse side of the base material, and it is also impossible to directly print the two-sided circuit. Or multiple circuits are directly stac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K1/097H05K3/4611
Inventor 林聚于洋王倩刘静
Owner BEIJING DREAM INK TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap