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Sheet for resin film formation

A resin film and sheet technology, applied in synthetic resin layered products, film/sheet adhesives, applications, etc., can solve the problems of reduced product yield, insufficient thickness accuracy of protective film, etc. scar effect

Active Publication Date: 2017-07-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thickness precision of the protective film formed in this way is not sufficient, the yield of the product may be lowered

Method used

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  • Sheet for resin film formation
  • Sheet for resin film formation
  • Sheet for resin film formation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Hereinafter, the details of the sheet for resin film formation of this invention are demonstrated.

[0039] figure 1 It is a plan view showing the first embodiment of the resin film forming sheet 10 of the present invention, figure 2 for will figure 1 The shown resin film forming sheet 10 is a schematic cross-sectional view when cut along the line A-A. Such as figure 1 and figure 2 As shown, the sheet 10 for resin film formation of this invention has the structure which laminated|stacked the support sheet 11, the resin film formation layer 12, and the peeling film 13 in this order.

[0040] In addition, the support sheet 11 and the resin film forming layer 12 are cut into a desired planar shape and partially laminated on the release film 13 . Here, the desired planar shape of the laminate composed of the support sheet 11 and the resin film forming layer 12 is not particularly limited as long as the laminate is partially laminated on the release film 13. It is pr...

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Abstract

The subject of this invention is providing the sheet|seat for resin film formation which can suppress generation|occurence|production of the curl mark in a resin film formation layer when it rolls up. The sheet for forming a resin film of the present invention is formed by sequentially laminating a support sheet, a resin film forming layer, and a release film, and the thickness of the release film is 50 μm or more.

Description

technical field [0001] The present invention relates to a sheet for forming a resin film capable of efficiently forming a resin film having high adhesive strength to a chip and capable of manufacturing a highly reliable semiconductor device. Background technique [0002] After the semiconductor wafer manufactured in a state of a large diameter is cut and separated (diced) into element pieces (semiconductor chips), it may be moved to a bonding step of the next step. At this time, the semiconductor wafer is transferred to the next step of bonding (bonding) after the steps of dicing, washing, drying, expanding, and picking up are carried out in a state adhered to the adhesive sheet in advance. [0003] Among these steps, in order to simplify the process of the pick-up step and the bonding step, various adhesive sheets for dicing and die-bonding have been proposed that can perform both the wafer fixing function and the die-bonding function. For example, by using such an adhesiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B5/00C09J7/00H01L21/301H01L21/52C09J7/20
CPCB32B7/06B32B27/06C09J2203/326H01L23/3107H01L21/561H01L2924/0002B32B2307/58B32B2307/748B32B2457/00C09J7/20B32B7/05C09J2301/204H01L2924/00B32B5/00
Inventor 久保田新村上幸范野村秀一
Owner LINTEC CORP
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