Sheet for forming resin film

A resin film and sheet technology, applied in the direction of synthetic resin layered products, film/sheet adhesives, applications, etc., can solve the problems of reduced product yield, insufficient thickness precision of protective film, etc., to prevent curling scar effect

Active Publication Date: 2016-06-08
LINTEC CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thickness precision of the protective film formed in this way is not sufficient, the yield of the product may be lowered

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sheet for forming resin film
  • Sheet for forming resin film
  • Sheet for forming resin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Hereinafter, the details of the sheet for resin film formation of this invention are demonstrated.

[0039] figure 1 It is a plan view showing the first embodiment of the resin film forming sheet 10 of the present invention, figure 2 for will figure 1 The shown resin film forming sheet 10 is a schematic cross-sectional view when cut along the line A-A. Such as figure 1 and figure 2 As shown, the sheet 10 for resin film formation of this invention has the structure which laminated|stacked the support sheet 11, the resin film formation layer 12, and the peeling film 13 in this order.

[0040] In addition, the support sheet 11 and the resin film forming layer 12 are cut into a desired planar shape and partially laminated on the release film 13 . Here, the desired planar shape of the laminate composed of the support sheet 11 and the resin film forming layer 12 is not particularly limited as long as the laminate is partially laminated on the release film 13. It is pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention addresses the problem of providing a sheet for forming a resin film, said sheet being such a sheet that the occurrence of winding marks in a resin-film-forming layer in winding the sheet into a roll can be suppressed. This sheet for forming a resin film is a sheet which is obtained by laminating a support sheet, a resin-film-forming layer, and a release film in this order and in which the thickness of the release film is 50<mu>m or more.

Description

technical field [0001] The present invention relates to a sheet for forming a resin film capable of efficiently forming a resin film having high adhesive strength to a chip and capable of manufacturing a highly reliable semiconductor device. Background technique [0002] After the semiconductor wafer manufactured in a state of a large diameter is cut and separated (diced) into element pieces (semiconductor chips), it may be moved to a bonding step of the next step. At this time, the semiconductor wafer is transferred to the next step of bonding (bonding) after the steps of dicing, washing, drying, expanding, and picking up are carried out in a state adhered to the adhesive sheet in advance. [0003] Among these steps, in order to simplify the process of the pick-up step and the bonding step, various adhesive sheets for dicing and die-bonding have been proposed that can perform both the wafer fixing function and the die-bonding function. For example, by using such an adhesiv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/00C09J7/00H01L21/301H01L21/52C09J7/20
CPCB32B7/06B32B27/06C09J2203/326H01L23/3107H01L21/561H01L2924/0002B32B2307/58B32B2307/748B32B2457/00C09J7/20B32B7/05C09J2301/204H01L2924/00B32B5/00
Inventor 久保田新村上幸范野村秀一
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap