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Film roll for producing semiconductor device

A technology of semiconductor and film roll, applied in semiconductor/solid-state device manufacturing, semiconductor device, semiconductor/solid-state device parts and other directions, can solve the problem of inability to adhere semiconductor chips or adherends, semiconductor chips fall off, and inability to exert adhesive force and other problems, to achieve the effects of excellent adhesion, prevention of curling marks, and good adhesiveness

Active Publication Date: 2011-10-26
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when winding with a strong tension to align the end faces of the reel, stress concentrates in the center direction of the reel, and as a result, for example, curl marks (roll marks) are generated on the edge portion and the dicing / die-bonding film wound thereon. )
When a semiconductor wafer with a thickness of 100 μm or less is mounted on such a dicing / die-bonding film, there is a problem that the semiconductor wafer has a height difference due to the curling of the film.
In addition, when a semiconductor wafer is cut to obtain a semiconductor chip, and the semiconductor chip is pasted on an adherend through an adhesive layer, the adhesive layer with curls cannot sufficiently adhere to the semiconductor chip or the adherend, and therefore cannot exert sufficient adhesive force. Stickiness
As a result, there is a problem that the semiconductor chip comes off from the adherend

Method used

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  • Film roll for producing semiconductor device
  • Film roll for producing semiconductor device
  • Film roll for producing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] 3 parts by weight of a polyfunctional isocyanate crosslinking agent, 23 Parts by weight of epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., Epicoat 1004), 6 parts by weight of phenolic resin (manufactured by Mitsui Chemicals Co., Ltd., Mirex XLC-LL) and 60 parts by weight of spherical silica (manufactured by Admatex Co., Ltd., S0 -25R) was dissolved in methyl ethyl ketone to prepare an adhesive composition solution with a concentration of 20% by weight.

[0100] This adhesive composition solution was coated on a release-treated film (core material) made of a polysiloxane release-treated polyethylene terephthalate film (thickness 50 μm) as a release liner, Dry at 120°C for 3 minutes. Thus, an adhesive bond layer with a thickness of 25 μm was formed on the release-treated film.

[0101] Then, the solution of the acrylic adhesive composition was coated on a substrate made of a polyolefin film with a thickness of 100 μm and dried to form an adhesive layer with a ...

Embodiment 2

[0106] In Example 2, the film roll of this Example was produced in the same manner as in Example 1, except that a core with a diameter of 6 inches (15.24 cm) was used instead of a core with a diameter of 3 inches (7.62 cm).

Embodiment 3

[0108] In this Example 3, 50 sheets of dicing / die-bonding film were wound onto a core with a diameter of 3 inches (7.62 cm), and the diameter of the rolled film roll was 11.3 cm. Example 1 is operated in the same manner to make the film roll of this embodiment.

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Abstract

The present invention relates to a film roll for use in producing a semiconductor device, the film roll comprising a cylindrical core and a film for semiconductor device production which has been wound on the core into a roll. The film roll is characterized in that the core has a diameter in the range of 7.5-15.5 cm.

Description

technical field [0001] The present invention relates to a film roll for semiconductor device manufacturing such as a dicing / die-bonding film used in a method for manufacturing a semiconductor device, which is wound into a roll form. Background technique [0002] The semiconductor wafer on which the circuit pattern is formed is diced into semiconductor chips after being adjusted in thickness by back grinding as necessary (dicing process). Then, the semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (die attaching process), and then moves to a bonding process. In the die attaching process, conventionally, an adhesive is applied to a lead frame or a semiconductor chip. However, in this method, it is difficult to achieve uniformity of the adhesive layer, and application of the adhesive requires special equipment or takes a long time. Therefore, a dicing / die-bonding film that adhesively holds a semiconductor wafer in a dicing process and also provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02H01L21/301H01L21/52C09J7/20
CPCC09J2203/326C09J2433/00C09J2461/00C09J2463/00H01L21/561H01L21/67132H01L21/6835H01L23/3121H01L24/27H01L24/29H01L24/83H01L2221/68336H01L2224/27436H01L2224/2919H01L2224/29198H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/83101H01L2224/83191H01L2224/8385H01L2224/92H01L2224/92247H01L2924/01004H01L2924/01005H01L2924/01013H01L2924/01015H01L2924/0102H01L2924/01027H01L2924/01029H01L2924/0103H01L2924/01033H01L2924/01046H01L2924/01047H01L2924/0105H01L2924/01051H01L2924/01056H01L2924/01057H01L2924/01074H01L2924/01079H01L2924/01082H01L2924/07802H01L2924/3025H01L24/48H01L2224/29H01L2924/01006H01L2924/01019H01L2924/01024H01L2924/01045H01L2924/014H01L2924/0665H01L2224/29101H01L2224/32225H01L2224/32245H01L2224/48247H01L2224/29318H01L2224/29371H01L2224/29324H01L2224/2929H01L2224/29311H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/29386H01L2224/29393H01L2924/00013H01L2924/15747H01L2924/181H01L24/73H01L2924/00014C09J7/20C09J2301/208H01L2924/0635H01L2924/066H01L2924/00H01L2924/3512H01L2924/00012H01L2924/05442H01L2924/05432H01L2924/0532H01L2924/04642H01L2924/05042H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/45099H01L2224/45015H01L2924/207C09J7/22C09J7/30B65D85/672H01L21/52C09J2301/12C09J2301/314C09J2301/40
Inventor 三隅贞仁
Owner NITTO DENKO CORP
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