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A thermal fuse and its organic temperature-sensing body

A thermal fuse, an organic technology, applied in the field of fuses, can solve the problems of poor durability and continuity, low accuracy of melting temperature, aging and deterioration, etc., to achieve good durability and continuity, high accuracy of operating temperature, and anti-oxidation performance strong effect

Active Publication Date: 2018-09-11
DONGGUAN BETTER ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) The mechanical strength is low, and it may break when it is crimped with the compressed thick spring, which will cause the fuse to fail;
[0006] 2) The accuracy of the melting temperature is low and the fusing speed is slow, so that the fusing is not timely and the circuit is damaged, which greatly reduces the safety and reliability of the product;
[0007] 3) The durability and durability are poor, and there will be aging and deterioration, easy sublimation and smaller, resulting in a short service life

Method used

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  • A thermal fuse and its organic temperature-sensing body
  • A thermal fuse and its organic temperature-sensing body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The preparation of organic temperature sensing body 27:

[0054] First mix 10% adipic acid, 60% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 3% polyethylene, 5% ethanol and 2% poly The amide wax was stirred evenly, and then the organic temperature-sensitive body 27 of Example 1 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 142±2°C.

[0055] Preparation of thermal fuse:

[0056]The thermal fuse includes a metal case 1 and a fuse 2 arranged inside the metal case 1, the metal case 1 is engraved with a product logo; one end of the metal case 1 is provided with a first pin 3, and the metal case 1 The other end is provided with a second pin 4, the first pin 3 is connected to the fuse 2 through a seal 5, and the material of the seal 5 is epoxy resin; the fuse 2 includes ...

Embodiment 2

[0059] Different from Example 1 is the preparation of organic temperature sensing body 27:

[0060] First mix 30% malonic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 4% polypropylene, 5% ethanol and 1% hydrogenated Castor oil was stirred evenly, and then the organic temperature-sensitive body 27 of Example 2 was obtained through the steps of granulation, compression and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 132±2°C.

[0061] The rest are the same as in Embodiment 1, and will not be repeated.

[0062] The operating temperature of the thermal fuse was tested to be 133±2°C, with an average value of 132.6°C.

Embodiment 3

[0064] Different from Example 1 is the preparation of organic temperature sensing body 27:

[0065] First mix 30% succinic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 2% polystyrene, 6% methanol and 2% organic Stir the bentonite evenly, and then go through the steps of granulation, pressing and drying to obtain the organic temperature-sensitive body 27 of Example 3. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 178±2°C.

[0066] The rest are the same as in Embodiment 1, and will not be repeated.

[0067] The operating temperature of the thermal fuse was tested to be 179±2°C, with an average value of 178.8°C.

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PUM

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Abstract

The invention belongs to the technical field of fuses and especially relates to an organic compound temperature fuse and an organic temperature-sensing body thereof. The organic temperature-sensing body comprises the following components, by weight, 10% to 30% of organic acid, 40% to 60% of succinic anhydride, 20% to 40% of dimethyl terephthalate, 2% to 10% of adhesive, 5% to 20% of organic solvent, and 1% to 10% of thixotropic agent. The organic temperature-sensing body with melting temperature from 60 to 180 degrees centigrade can be blended via the above components and ratios, and is high in mechanical strength, good in oxidation resistance, high in melting temperature sensitivity, and fast in fusing speed.

Description

technical field [0001] The invention belongs to the technical field of fuses, and in particular relates to an organic compound type thermal fuse and an organic temperature sensing body thereof. Background technique [0002] As we all know, in household appliances and industrial equipment, in order to prevent fire caused by excessive electric heating, in addition to over-current protection, over-temperature protection is also required; due to the small size of the thermal fuse, mature technology, reliable operation and low price, therefore, Thermal fuses are widely used in home appliances as over-temperature protection components. [0003] At present, thermal fuse products are roughly divided into two categories. One is an alloy-type thermal fuse that uses a low-melting point alloy as a temperature-sensing element; the other is an organic compound-type thermal fuse that uses an organic material as a temperature-sensing body. The strength of the temperature-sensing body is us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H85/06H01H85/175
CPCH01H85/06H01H85/175
Inventor 胡智敏韩露
Owner DONGGUAN BETTER ELECTRONICS TECH
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