34results about How to "Large current carrying capacity" patented technology

A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

The invention relates to a multi-split bus, which is characterized in that: 1, a tubular electric conductor adopts a multi-split conductor, an insulating layer is arranged between two conductors, and each conductor has two electric conducting surfaces; 2, a rectangular electric conductor adopts a multi-layer split conductor, an insulating layer is arranged between two conductors, each conductor has two electric conducting surfaces, and the like; and 3, in a stranded wire type electric conductor, each strand of each layer of a conductor has an insulating layer (each strand of the conductor of a path-resistant stranded wire has the insulating layer). The current-carrying capacity is large, the temperature rise is low, the weight is light, non-ferrous metals are saved, the energy is saved, and the environment is protected. Under low temperature, only a part of the split conductors transmit the prior rated current, and the temperature rise of the conductor is higher than normal temperature rise; and without power-off, ice and snow cannot be hung on the conductor so as to prevent the ice and the snow overwhelming lines to avoid power failure. The multi-split bus has wide social benefit on improving power supply reliability.

The present invention relates to a superconductive current limiter component with magnetic field triggering having a tubular superconductor element (1) which is connected in electrical parallel with a trigger coil (3), wherein the trigger coil runs from a first end of the tubular superconductor element (1) on one side of the lateral face of the tubular superconductor element (1) in the direction of the second end of the tubular superconductor element (1), is deflected at that point to the other side of the lateral face and runs back in the direction of the first end, and so on.

The invention discloses a connecting device, in particular a connecting device for a busbar channel and switch circuit breaker in switchgear and belongs to the technical field of distribution switchgear. The device comprises multiple insulation modules provided with mounting grooves and conductive plug strips, wherein the insulation modules press the conductive plug strips in the mounting grooves to form busbar plug channels, the device further comprises outer protective cases which sleeve the insulation modules and are used for protection and reinforcement, the insulation modules sleeve the conductive plug strips through the outer protective cases, and insulation partitions for isolation are arranged among plug channels. With the adoption of the connecting device, the problem that circuits for electrical connection in the switchgear are complex is solved, so that inner connecting units are modular, the connecting device is easy to assemble and free from maintenance due to adoption of the plug manner, the structure in the switchgear is effectively optimized, and the cost is reduced.

The present invention relates to a 5G metal / ceramic composite circuit board and a preparation method therefor. The preparation method comprises the following steps: alternately depositing metal layers and ceramic layers on a metal substrate with a preset hole by using a PVD technique, to obtain a 5G metal / ceramic composite circuit board. According to the preparation method for a metal / ceramic composite circuit board of the present invention, the difficulties of a conventional technique (a ceramic / metal thermal diffusion bonding method) for a metal / ceramic composite circuit board, such as being complex, low in yield, high in price, low in efficiency and undeveloped in terms of technique, are avoided. In addition, according to the preparation method of the present invention, a metal substrate with a hole is selected, such that the problems of laser / mechanical composite drilling of a ceramic substrate whereby same is low in yield, large in terms of workload, and undeveloped in terms of drilling technique, are solved. In the present invention, a combined technique of a physical vapor deposition technique and a template technique is used to deposit the metal layer and the ceramic layer, all the layers in the obtained metal / ceramic composite circuit board are high in terms of bonding strength and are not prone to stripping, and the technique is simple.

The invention discloses a multi-circuit integrated comprehensive connection system. The system comprises a total input module and a main current carrying module, wherein a total input end and a bus integration end are arranged on the total input module; the total input end is that a current input end is connected with a total switch; the bus integration end is a current output end of the total input module; the total input end is communicated with the bus integration end through a bus transition component; the bus integration end is used for connecting current output to the main current carrying module through a bus; a bus input end, a current main carrying plate and a sub wire integration output end are arranged on the main current carrying module; the bus is communicated with the bus input end; the current is introduced to the current main carrying plate through the bus input end; the sub wire integration output end is communicated with the current main carrying plate; one end of a sub wire is communicated with the sub wire integration output end; and the other end of the sub wire is connected with a sub switch. According to the invention, large-current input, integrated shunting, large-current butt-joint, standard manufacturing and mounting functions can be achieved, spaces can be saved, the standardization and consistency of products are improved, and connecting differences of electric components are reduced.

The invention discloses a multi-layer tubular busbar structure, which is characterized by comprising at least two layers of tubular busbars arranged from the inside to the outside and at least two positioning plates, wherein the positioning plates are installed at the ends of all the tubular busbars, Position each layer of tubular busbars. The multi-layer tubular busbar structure of the present invention can meet the requirements of large current, high current carrying and electric field optimization. The large current-carrying problem is solved by increasing the surface area; the air convection is realized by using the gap of its structure; the optimized electric field performance is solved by using the tube shape and arc shape. Adds an alternative to busbar selection for high current carrying, high heat dissipation, electric field optimized applications. The multi-layer tubular busbar has mature production technology, flexible splicing and uniform electric field distribution.

The invention discloses a high-current plug of a model airplane. The high-current plug comprises a plug, a socket, plug conductors and socket conductors. The plug conductors are assembled on two sides of the plug, and the socket conductors are assembled on two inner sides of the socket. An elastic hoop is arranged on a side of the plug, so that the plug and the socket can be in contact with each other by multiplied reinforcement and can be in close fit with each other in a reliable conducting manner, and the work stability of the socket can be conveniently kept. The plug conductors and the socket conductors are embedded into plastics during injection molding, so that the firm plug and the firm socket can be formed. A direction groove is formed in a side of the socket, and conducting wire welding positions are reserved in the direction groove when the plug conductors are matched with the direction groove, so that correct directions of an anode and a cathode can be assuredly kept when the plug is plugged into the socket. The high-current plug of the model airplane has the advantages that the high-current plug is simple and reliable in structure, low in cost, convenient in connection and disconnection operation and high in practicality, can work stably and has a broad application prospect, and the high conducting reliability can be kept.

The invention discloses a novel onboard switch composed of a plug pin base and a flexible plug pin. The plug pin base is composed of a substrate, a lower metal elastic sheet and an upper metal elastic sheet. The substrate is made of insulated materials. The lower metal elastic sheet is of a rectangular thin sheet shape and is installed on the left side of the substrate. The upper metal elastic sheet is of an n shape. The right side of the upper metal elastic sheet is installed on the right side of the substrate. When no external force is exerted, the left side of the upper metal elastic sheet makes natural contact with the lower metal elastic sheet, so that a plug pin hole is formed between the upper metal elastic sheet and the lower metal elastic sheet. The flexible plug pin is composed of a front plastic portion and a rear metal portion. The tail portion of the plastic portion is fixedly connected with the head portion of the metal portion in a seamless mode. When the left side of the upper metal elastic sheet makes contact with the lower metal elastic sheet, the head portion of the plastic portion can extend into the plug pin hole between the upper metal elastic sheet and the lower metal elastic sheet. The novel onboard switch has the advantages of being large in borne current, applicable to occasions with the strict requirement for the size and the weight, and capable of serving as not only a circuit power supply switch but also a motion detection switch.

The invention discloses a contact terminal, which comprises a bracket and a plurality of contact pieces, the bracket strings together the plurality of contact pieces so that the plurality of contact pieces form an annular structure, and the contact piece includes a first contact arm and a second contact arm , the first contact arm is located at the inner side of the annular structure, the second contact arm is located at the outer side of the annular structure, and the first contact arm is a hyperboloid structure. The invention also discloses an electrical connector and an electronic device including the above-mentioned contact terminal. In the embodiment of the present invention, through the annular structure composed of a plurality of contact pieces, the electrical contact is changed from the line contact of the wire spring to the surface contact, which increases the contact area, effectively reduces the contact resistance, and increases the terminal current carrying at the same time. The spring has the characteristics of low insertion force, so as to achieve the dual purpose of increasing the current carrying capacity and improving the service life.

A plug-type connector (5) for connecting with a mating plug-type connector (3) includes a housing (50), and the housing has a The socket part (500, 501), and at least one socket part (500, 501) arranged on the socket part (500, 501), which has a shaft part (510) and is used to be assigned to the mating connector (3) The contact elements (51A, 51B) are in electrical contact with the mating contact elements (31). In addition, there is also a device arranged on the shaft portion (510) of the at least one contact element (51A, 51B) and fixedly connected with the shaft portion (510) for absorbing the at least one contact element (51A, 51B). ) heat capacity elements (54A, 54B). In this way, a plug-in connection is provided which contains contact elements which can have a relatively high current-carrying capacity, for example for an electric vehicle charging system.