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Supporting equipment and supporting methods

A technology for supporting equipment and supporting methods, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as product defects, deformation of display substrates, and easily damaged display substrates

Active Publication Date: 2019-08-20
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this separation process, due to the small contact area between the display substrate and the ejector pins, the display substrate is under pressure at the position where it contacts the ejector pins, which is easy to damage the display substrate, resulting in product defects, especially for large-sized display substrates. words may cause severe deformation

Method used

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  • Supporting equipment and supporting methods
  • Supporting equipment and supporting methods
  • Supporting equipment and supporting methods

Examples

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Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] One aspect of the present invention provides a supporting device, comprising: a carrying substrate for carrying a carried component, the carrying substrate has a first main surface facing the carried component and a surface on the opposite side of the first main surface a second main surface; and a pressure dividing plate disposed on the carrier subst...

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Abstract

A supporting device and a supporting method. The supporting device includes: a carrying substrate for carrying a carried part, the carrying substrate having a first main surface facing the carried part and a second main surface on the opposite side of the first main surface; and a pressure dividing plate , disposed on the first main surface of the carrying substrate and between the carrying substrate and the carried component, wherein the pressure dividing plate is configured to drive the carried component to separate from the carrying substrate.

Description

technical field [0001] Embodiments of the present invention relate to a supporting device and a supporting method. Background technique [0002] During the preparation process of the display substrate, it is necessary to perform various processing on the display substrate, such as vapor deposition, sputtering and the like. During various processing, a carrier substrate is usually used to support the display substrate. After the processing is finished, the carrier substrate and the display substrate are sent to the separation chamber together, and the display substrate is lifted up by the ejector pin base, so as to realize the separation of the display substrate and the carrier substrate. During the separation process, due to the small contact area between the display substrate and the ejector pins, the display substrate is under pressure at the position where it contacts the ejector pins, which is easy to damage the display substrate, resulting in product defects, especiall...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/683
CPCH01L21/6734H01L21/6875H01L21/68785H01L21/67346H01L21/68742H01L21/6835H01L2221/68318H01L2221/68381
Inventor 苏志玮
Owner BOE TECH GRP CO LTD