Metallographic phase grinding sample pressure adjusting device and metallographic phase grinding and polishing device and method

A pressure adjustment and metallographic grinding technology, applied in grinding devices, metal processing equipment, grinding machine tools, etc., can solve the problems of high sample preparation requirements and expensive equipment, and achieve the effects of simple operation, cheap equipment and accurate pressure application.

Active Publication Date: 2016-08-31
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of sample preparation is difficult to adapt to today's large amount of practical research with high sample preparation requirements
However, although the new automatic grinding and polishing equipment can achieve efficient and fast sample preparation, the equipment is expensive, and it takes tens to hundreds of yuan to prepare a sample, so it is difficult to promote and use it in large quantities in enterprises and general universities.

Method used

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  • Metallographic phase grinding sample pressure adjusting device and metallographic phase grinding and polishing device and method
  • Metallographic phase grinding sample pressure adjusting device and metallographic phase grinding and polishing device and method

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Embodiment Construction

[0064] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0065]In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, o...

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Abstract

The invention relates to the technical field of metallographic phase grinding, in particular to a metallographic phase grinding sample pressure adjusting device and a metallographic phase grinding and polishing device and method. The metallographic phase grinding sample pressure adjusting device comprises a fixed rod, a rotary connection rod and a sample clamping mechanism which are all sequentially connected; the sample clamping mechanism comprises an adjusting sleeve, a pin shaft arranged in the adjusting sleeve, a fastener installed at the upper end of the pin shaft, a spring arranged on the pin shaft in a sleeving manner and pressed in the adjusting sleeve through the pin shaft, and a sample clamping sleeve detachably installed at the lower end of the pin shaft and used for clamping a metallographic phase sample. The metallographic phase grinding and polishing device comprises the metallographic phase grinding sample pressure adjusting device, a cushion plate, a grinding and polishing disk and a motor. During grinding and polishing, firstly, pressure is preset, and then by adjusting the fastener of the pin shaft to be connected with the adjusting sleeve, the pressure is loaded onto the metallographic phase sample. According to the metallographic phase grinding sample pressure adjusting device and the metallographic phase grinding and polishing device and method, one or more metallographic phase samples can be pre-ground and polished on the same equipment, and pressure acting on the samples is adjustable and can be automatically released.

Description

technical field [0001] The invention relates to the technical field of metallographic grinding, in particular to a metallographic grinding sample pressure regulator, metallographic grinding and polishing equipment and a grinding and polishing method. Background technique [0002] During the development and research of metal materials such as steel and non-ferrous alloys, it is usually necessary to observe and analyze the microstructure of the material. The first thing to be completed is the sample acquisition-grinding-polishing-corrosion process. Whether a metallographic sample with a smooth surface and a qualified corrosion can be obtained directly determines the accuracy of material analysis. At the same time, in an actual study of metal structure and properties, it is necessary to grind and polish as many as hundreds or even more metallographic samples, especially for hard quenched steel, nickel-based alloys or soft magnesium alloys, aluminum alloys, etc. For non-ferrous...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/30B24B37/34B24B37/10
CPCB24B37/10B24B37/30B24B37/34
Inventor 田勇郝浩腾王昭东邓想涛王丙兴韩毅李勇
Owner NORTHEASTERN UNIV
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