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The present application relates to the technical field of perovskite devices, and particularly relates to a packaging method of a perovskite device. The packaging method provided by the present application comprises the following steps: mixing methyl methacrylate, 2-methyl-2-acrylic acid-2-hydroxyethyl ester phosphate and 2-hydroxy-2-methyl-1-phenylpropanone to obtain a packaging slurry; coating the packaging slurry on the surface of the perovskite device, covering a glass plate, and performing light curing. The packaging method can improve the photoelectric current density of the device, thereby improving the efficiency of the device, and can significantly improve the outdoor stability of the device.