An external transmission electron microscope image digital acquisition device and system

Abstract

The invention discloses a digital image acquisition device of an external transmission electron microscope. The digital image acquisition device comprises an external shell and a CCD camera, wherein an opening is formed in at least one side of the external shell; the CCD camera is arranged at an open end of the external shell; the CCD camera converts a photosignal into an electric signal; and the external shell is detachably fixed outside an observation window of the transmission electron microscope. According to the digital image acquisition device of the external transmission electron microscope, the CCD camera is arranged outside the observation window and is arranged outside a transmission electron beam path and a bottom CCD system does not need to be used, so that the defects that the bottom CCD system is bombarded by electrons and easily damaged in the transmission electron beam path in the prior art are avoided. Meanwhile, if the CCD camera is damaged, one external device is replaced, so that the problem that maintenance is troublesome due to the fact that components of the transmission electron microscope need to be dismantled when the CCD camera is replaced in the prior art is solved. Furthermore, the external device disclosed by the invention is suitable for various models of transmission electron microscopes.

Description

technical field [0001] The invention relates to an image acquisition device and system, in particular to a transmission electron microscope image digital acquisition device and system. Background technique [0002] Transmission electron microscope, referred to as transmission electron microscope, its basic working principle is as follows: the electron beam emitted by the electron gun passes through the condenser along the optical axis of the mirror body in the vacuum channel, and is converged into a bunch of sharp, bright and uniform beams through the condenser. The light spot is irradiated on the sample in the sample chamber; the electron beam passing through the sample carries the structural information inside the sample, the amount of electrons passing through the dense part of the sample is small, and the amount of electrons passing through the sparse part is large; after the convergence modulation of the objective lens After focusing and primary amplification, the elect...

AI Technical Summary

Problems solved by technology

[0004] The defects of the above-mentioned transmission electron microscope are: 1. the CCD camera is installed at the bottom of the transmission electron microscope, through the passage of the transmission electron beam, the high-energy transmission electron beam is easy to cause damage to the CCD image sensor in the CCD camera, and its service life is greatly reduced; 2. It is inconvenient to replace the CCD camera or CCD image sensor, and the relevant devices at the bottom of the transmission electron microscope need to be disassembled, and the maintenance cost is high

[0006] Although the CCD image sensor in this side-mounted CCD system is not in the path of the transmitted electron beam, thus avoiding damage caused by direct bombardment by the transmitted electron beam, the defect of this side-mounted CCD system is: the small fluorescent screen enters Or when exiting the transmitted electron beam path, due to the error of mechanical movement, it is impossible to return to the original position accurately, resulting in the relative position between the small fluorescent screen and the CCD image sensor is easy to change, in order to make the image accurate, it is necessary to re-image each time Correction; In addition, compared with the bottom fluorescent screen, the small fluorescent screen is located above the transmission electron beam path, and its imaging magnification is small, which is convenient for sample pre-observation and finding the region of interest, but because of the small magnification, it cannot Obtain images with a large multiple of the method, so the side-mounted CCD system often cannot replace the bottom-mounted CCD system. After completing the search and pre-observation through the side-mounted CCD system, it is necessary to use the bottom-mounted CCD system to more accurately find the observation position and carry out HD shooting

[0007] Therefore, even for the transmission electron microscope that is equipped with a side-mounted CCD system and a bottom-mounted CCD system at the same time, the CCD image sensor in the bottom-mounted CCD system cannot be avoided from being bombarded by the transmitted electron beam and is easily damaged. After the CCD image sensor at the bottom is damaged, it is inconvenient to replace and the maintenance cost is high

Images