Compound isolator

Abstract

The invention discloses a compound isolator which comprises a metal plate (1), a dielectric layer (2) and a polytetrafluoroethylene layer (3). A PP layer A (8) is arranged between a circuit layer (4) on the upper surface and the metal plate (1). A PP layer B (9) is arranged between a circuit layer (4) on the lower surface and the polytetrafluoroethylene layer (3). The PP layer A (8) and the PP layer B (9) are provided with through holes (10). Ferrites (11) are arranged in the through holes (10). Adhesive layers (16) are arranged at the contact of the dielectric layer (2) and the PP layers, between the metal plate (1) and the PP layer A (8), and between the polytetrafluoroethylene layer (3) and the PP layer (9). A circuit via hole (15) is arranged between the circuit layers (4) on upper and lower surfaces of the dielectric layer (2). The compound isolator provided by the invention has the advantages that the product volume is greatly reduced; the compound isolator can be integrated with a reciprocal transmission device in a substrate; the electrical performance and reliability are improved; and electromagnetic wave disturbance can be prevented.

Description

technical field [0001] The invention relates to the technical field of isolator structures, in particular to a composite isolator. Background technique [0002] The isolator, also known as the one-way device, is a device that transmits electromagnetic waves in one direction. When the electromagnetic wave passes through the isolator in the opposite direction, all the power can be fed to the load, and the reflected wave from the load will be greatly attenuated. This unidirectional transfer characteristic can be used to isolate the effect of load changes on the signal source. Known reciprocal transmission devices, such as filters, inductors, capacitors, etc., are integrated in the circuit substrate, but the isolator cannot be integrated inside the substrate, so the isolator is usually installed outside the circuit substrate, resulting in an increase in the size of the module, and it is easy to Circuit mismatch and electromagnetic wave interference occur. Contents of the inve...

AI Technical Summary

Problems solved by technology

Known reciprocal transmission devices, such as filters, inductors, capacitors, etc., are integrated in the circuit substrate, but the isolator cannot be integrated inside the substrate, so the isolator is usually installed outside the circuit substrate, resulting in an increase in the size of the module, and it is easy to Circuit mismatch and electromagnetic interference

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