Methods and apparatus for cutting radii in flexible thin glass

A technology of equipment and radius, applied in glass manufacturing equipment, glass cutting device, welding equipment, etc., can solve problems such as bad characteristics, and achieve the effect of reducing particle generation, simplifying cutting equipment, and improving cutting results

Active Publication Date: 2017-02-22
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] While the aforementioned flexible plastic substrates have come into widespread use, they exhibit undesirable properties related to at least providing a moisture barrier and providing very thin structures (indeed, due to the nature of the plastic material, these structures are relatively thick)

Method used

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  • Methods and apparatus for cutting radii in flexible thin glass
  • Methods and apparatus for cutting radii in flexible thin glass
  • Methods and apparatus for cutting radii in flexible thin glass

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Embodiment Construction

[0024] Reference is made to the figures in which like numerals indicate like elements. exist figure 1 A top view of a thin glass substrate 10 produced using one or more of the cutting methods and apparatus disclosed herein is shown in FIG. A number of properties of glass substrate 10 are of importance when considering the disclosure herein. First, the glass substrate 10 (and the source glass sheet from which it is cut) is thin and / or ultra-thin, having a thickness of less than about 0.2 mm, such as between about 0.01 mm and 0.2 mm, between about 0.05 mm to 0.2 mm, and / or between about 0.1 mm to about 0.2 mm. While these thicknesses are considered preferred, the glass substrate 10 may be thinner and / or thicker than the mentioned ranges. Second, glass substrate 10 is considered to be a free-form shape, eg, having at least one curved portion, with one or more radii of curvature, anywhere from a minimum of about 2mm up to about 20mm. For example, glass substrate 10 is shown wi...

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Abstract

Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Description

[0001] This application claims the benefit of priority to US Provisional Application Serial No. 61 / 942309, filed February 20, 2014, upon which this application is based and which is hereby incorporated by reference in its entirety. Background technique [0002] The present disclosure relates to methods and apparatus for cutting multiple radii into flexible thin glass. [0003] Conventional manufacturing techniques have been developed for cutting flexible plastic substrates employing a plastic base material laminated with one or more polymer films. These stacked structures are commonly used in flexible packaging associated with photovoltaic (PV) devices, organic light-emitting diodes (OLED), liquid crystal displays (LCD), and patterned thin-film transistor (TFT) electronics, mainly because of their relatively low cost and demonstrable performance. [0004] While the aforementioned flexible plastic substrates have come into widespread use, they exhibit poor properties related t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/09
CPCC03B33/04B23K26/14B23K26/53B23K2103/54C03B33/091C03B33/033Y02P40/57C03B33/0222
Inventor A·S·阿尔特曼C·W·科尔T·B·弗莱明A·刘J·J·沃特金斯
Owner CORNING INC
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