PCB laminate process and PCB

A process and multi-layer board technology, applied in the direction of lamination, lamination device, layered products, etc., can solve the problems of different degrees of board surface warpage, temperature difference, unstable reliability, etc., to ensure stability, layer The pressure state is consistent and the effect of improving the material temperature difference

Active Publication Date: 2019-04-16
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the large difference in actual material temperature will lead to obvious temperature differences between the inner and outer PCB boards when they are turned to high pressure (differences of 10°C-20°C), large differences in heating speed, etc., and ultimately the same lamination press cannot be guaranteed. The inner layer board and the outer layer board have the same lamination state, which will have a great impact on the quality stability of the batch board. For example, the inconsistent curing conditions of PCB products lead to unstable reliability. After pressing the inner layer board and the outer layer board The uneven stress of the board leads to different degrees of warping of the board surface, etc.

Method used

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  • PCB laminate process and PCB
  • PCB laminate process and PCB
  • PCB laminate process and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] as table 1 and figure 2 As shown, in this embodiment, a laminated board process for PCB includes the following steps:

[0044] placing the stacked multilayer boards under constant temperature and constant pressure conditions of a first temperature value and a first pressure value, and heating up the multilayer boards after a first time interval;

[0045] Lowering the temperature to a second temperature value, the second temperature value being lower than the first temperature value, placing the multi-layer board under constant temperature and constant pressure conditions of the second temperature value to raise the temperature of the multi-layer board after a second time interval;

[0046] Increase the temperature and pressure to press the multi-layer board.

[0047] In this embodiment, the material of the multilayer board is common FR-4. The melting temperature of the material resin is between 70°C and 80°C.

[0048] In this embodiment, the temperature is lowered t...

Embodiment 2

[0084] The difference between this embodiment and Embodiment 1 is:

[0085] The laminated board process of the PCB, the specific steps are as follows:

[0086] S20, stacking the outer layer board and the inner layer board to form a multi-layer board.

[0087] S21. Put the multi-layer board into the lamination press.

[0088] S22. Use the lamination press to set a constant temperature of 135° C. for 10 minutes; use the lamination press to set a pressure of 95 psi for 10 minutes.

[0089] S23. Use the lamination press to lower the temperature to 85° C. for 5 minutes, and then keep it at 85° C. for 1 minute; use the lamination press to set a pressure of 95 psi for 6 minutes.

[0090] S24. Use the lamination press to set the temperature to 150° C. for 6 minutes; use the lamination press to set a pressure of 95 psi for 6 minutes.

[0091] S25. Use the lamination press to set the temperature to 210°C for 8 minutes, and then set it to maintain 210°C for 18 minutes; use the laminat...

Embodiment 3

[0097] The difference between this embodiment and Embodiment 1 is:

[0098] The laminated board process of the PCB, the specific steps are as follows:

[0099] S30 , stacking the outer layer board and the inner layer board to form a multilayer board.

[0100] S31. Put the multi-layer board into the lamination press.

[0101] S32. Use the lamination press to set a constant temperature of 145° C. for 14 minutes; use the lamination press to set a pressure of 105 psi for 14 minutes.

[0102] S33. Use the lamination press to lower the temperature to 95° C. for 7 minutes, and then maintain the temperature at 95° C. for 3 minutes; use the lamination press to set a pressure of 95 psi for 10 minutes.

[0103] S34. Use a lamination press to set the temperature to 170° C. for 8 minutes; use a lamination press to set a pressure of 95 psi for 8 minutes.

[0104] S35. Use the lamination press to set the temperature to 220°C for 10 minutes, and then set it to maintain 220°C for 22 minutes...

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Abstract

The invention discloses a PCB (printed circuit board) laminating process, comprising the steps of heating multiple boards that are stacked under first temperature and first pressure constantly; decreasing the temperature to second temperature that is less than the first temperature such that the multiple boards are heated under the second temperature and pressure constantly; increasing the temperature and pressure to laminate the multiple boards. The invention also discloses a PCB manufactured by using the laminating process. By using the PCB laminating process and the PCB, an actual material temperature difference between inner and outer boards of the PCB can be significantly improved, lamination states of the inner and outer boards are consistent, quality stability of batched boards is guaranteed, and consistent stress, namely, surface warping degree, of the inner and outer boards after laminating is ensured.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing process, in particular to a PCB lamination process and PCB. Background technique [0002] With the improvement of PCB production efficiency, it is more and more common for production equipment to work at full load. Taking the lamination press as an example, since the temperature of the hot plate is transmitted from the outer layer to the inner layer, the increase in the number of stacked layers of the lamination press or the increase in the thickness of the PCB will highlight the inner and outer layers. The difference in the actual material temperature of the board. However, the large difference in actual material temperature will lead to a significant temperature difference between the PCB inner layer board and the outer layer board when turning to high pressure (10°C-20°C difference), and a large difference in heating rate, etc., and ultimately the same lamination press cannot be guar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06
CPCB32B37/06B32B37/10B32B2457/08
Inventor 孙梁唐海波纪成光袁继旺陈正清
Owner DONGGUAN SHENGYI ELECTRONICS
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