Flexible electronic device and manufacturing method of flexible electronic device

Abstract

The invention discloses a flexible electronic device and a manufacturing process method of the flexible electronic device. The flexible electronic device includes a first flexible board, a first electronic component located on the first surface of the first flexible board, a second flexible board, a second electronic component located on the first surface of the second flexible board, and a first electronic component located on the first surface of the first flexible board. The adhesive layer between the first side of the flexible board and the first side of the second soft board. The adhesive layer covers the first electronic component and the second electronic component. Wherein, the first surface of the first flexible board has a first FPC (Flexible Print Circuit) junction area outside the adhesive layer, and the range projected from the first FPC junction area to the second soft board does not overlap with the second soft board. The first surface of the two flexible boards has a second FPC joint area outside the adhesive layer, and the projected range of the second FPC joint area to the first flexible board does not overlap with the first flexible board.

Description

technical field [0001] The invention relates to a flexible electronic device and a manufacturing process method of the flexible electronic device. Background technique [0002] In the existing technology for the production process of flexible electronic components, it is usually necessary to bond the flexible printed circuit board (FPC, Flexible Printed Circuit) and the substrate before the substrate and its electronic components are mounted Remove from the board. [0003] However, if the structure of the flexible electronic component is limited, and its manufacturing process needs to bond the FPC and the substrate in advance, according to the experimental results, when the substrate is removed from the carrier, when it is removed to the corresponding bonding The zone will generate a sudden increase in debonding force. Therefore, the above manufacturing process will not only cause difficulty in removing the substrate and its electronic components from the carrier, but also...

AI Technical Summary

Problems solved by technology

[0003] However, if the structure of the flexible electronic component is limited, and its manufacturing process needs to bond the FPC and the substrate in advance, according to the experimental results, when the substrate is removed from the carrier, when it is removed to the corresponding bonding The zone will generate a sudden increase in debonding force

Therefore, the above manufacturing process will not only cause difficulty in removing the substrate and its electronic components from the carrier, but also lead to a lower yield rate of the manufacturing process, which is not conducive to the large-area production of flexible electronic components.

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