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Heat dissipation unit

A heat dissipation unit and heat dissipation module technology, which is applied in the direction of electrical components, cooling/ventilation/heating transformation, electrical equipment construction parts, etc.

Active Publication Date: 2017-05-31
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly, but the size reduction of electronic equipment is accompanied by the Heat Becomes Major Barrier to Improving Performance of Electronic Devices and Systems

Method used

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Embodiment Construction

[0061] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the embodiments of the accompanying drawings.

[0062] see figure 1 It is a three-dimensional exploded schematic diagram of the present invention; figure 2 It is a three-dimensional combination schematic diagram of the present invention; image 3 It is a cross-sectional exploded schematic diagram of the present invention; Figure 4 It is a cross-sectional schematic diagram of the present invention; Figure 5 for Figure 4 The local enlarged schematic diagram. As shown in the figure, the present invention includes a casing 10 and at least one heat pipe 20 . The casing 10 is a flat heat conduction unit, such as a vapor chamber or a flat heat pipe, and has a top side 101, a bottom side 102 and a side edge 103 arranged between the top side 101 and the bottom side 102. . The side 103 defines at least one opening 1031 , and the number o...

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Abstract

The present invention provides a heat dissipation unit. The heat dissipation unit comprises a shell and a heat tube. The shell has a shell cavity which accommodates a working flow body. One inner wall of the shell cavity is provided with a shell capillary structure. The heat tube has an open end and a closed end. A heat tube cavity is between the open end and the closed end and is communicated with the shell cavity through the open end. The inner wall of the heat tube cavity is provided with a heat tube capillary structure that is connected with the shell capillary structure through the open end capillary of the heat tube.

Description

[0001] 【Technical field】 [0002] The invention relates to a heat dissipation unit, in particular to a heat dissipation unit applied to heat dissipation. [0003] 【Background technique】 [0004] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry proposes vapor chambers and heat pipes with better heat conduction performance to effectively solve the current heat dissipation problem. [0005] Vapor chamber is a rectangular shell (or plate body), with a capillary structure on the wall of the inner chamber of the shell, and the inside of the shell is filled with working liquid, and one side of the sh...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 蓝文基
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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