Method for manufacturing optical circuit substrate

Abstract

Provided is a method for manufacturing an optical circuit substrate. The method includes teh steps of forming an optical waveguide obtained by holding a core between a lower cladding layer and an upper cladding layer along the top surface of a glass plate, forming positioning marks on the side of the glass plate consisting of the same material as the core between the lower cladding layer and the upper cladding layer in a region outside the core, forming a reflective surface in a part of the core, preparing a wiring substrate having positioning marks on the side of a substrate, and carrying the glass plate forming the optical waveguide so that the positioning marks on the side of the glass plate and the positioning marks on the side of the substrate are superimposed.

Description

technical field [0001] The present invention relates to a method of manufacturing an optical circuit board having a reflective surface for redirecting an optical signal. Background technique [0002] Figure 5 In , a conventional optical circuit board B on which an electronic component D is mounted is shown. A conventional optical circuit board B includes a wiring board 20 and an optical waveguide 21 . Such a conventional optical circuit board B is described in JP-A-2005-99514, for example. [0003] The wiring board 20 includes an insulating layer 22 and a wiring conductor 23 . On the insulating layer 22, a through-hole 24 is formed. Wiring conductors 23 are formed on the upper and lower surfaces of the insulating layer 22 and inside the through-holes 24 . On the upper surface of the insulating layer 22, the electronic component connection pad 25 which consists of a part of the wiring conductor 23 is formed. The electronic component D is mounted on the electronic compon...

AI Technical Summary

Problems solved by technology

In addition, the wiring board 20 may warp due to the thermal history during manufacture.

If warping occurs, when cutting the core body 21b with a cutter to form the reflective surface M, the cutter cannot be accurately cut into a predetermined position of the core body 21b.

Therefore, the center axis of the extending direction of the core body 21b cannot be aligned with the center position of the reflection surface M.

As a result, optical signals cannot be accurately transmitted and received between the optical waveguide 21 and the electronic component D.

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