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A mold with automatic cooling and heat dissipation structure

A heat dissipation structure and automatic cooling technology, applied in the field of molds, can solve problems such as failure to automatically open

Active Publication Date: 2018-12-04
HEFEI DINGXIN MOLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method conducts heat dissipation throughout the whole process, and cannot be automatically turned on for situations higher than the predetermined value.

Method used

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  • A mold with automatic cooling and heat dissipation structure
  • A mold with automatic cooling and heat dissipation structure
  • A mold with automatic cooling and heat dissipation structure

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0023] Such as Figure 1-4 As shown, the present invention is a mold with an automatic cooling and heat dissipation structure, including a mold body 100, a cooling hole 101 is opened on the inner wall of the mold body 100, the cooling hole 101 communicates with a pipeline 200, the pipeline 200 communicates with a circulation pump 300, and the circulation pump 300 and The control mechanism 400 is electrically connected, and the control mechanism 400 is electrically ...

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Abstract

The invention discloses a mold with an automatic cooling and heat dissipation structure. The mold comprises a mold body. Cooling holes are formed in the inner wall of the mold body. The cooling holes communicate with a pipeline. The pipeline communicates with a circulating pump. The circulating pump is electrically connected with a control mechanism. The control mechanism is electrically connected with a power source. By the adoption of the mold with the automatic cooling and heat dissipation structure, when the temperature of the mold is higher than the preset value, a first rocking arm is compressed by a first spring and lifted up, a second rocking arm is not in contact with a terminal, a shell is heated when in surface contact with the mold body, and gas in the shell is heated and expands to push a piston to move upwards; and after the preset value is exceeded, the first spring is compressed, a second spring pulls the right end of the second rocking arm to make the second rocking arm tightly attached to the terminal, a magnet attracts iron fixed to the first rocking arm, the second rocking arm communicates with the terminal, the power source supplies power to the circulating pump, the shell is started automatically, and the mold body is cooled by the circulating pump.

Description

technical field [0001] The invention relates to the field of molds, in particular to a mold with an automatic cooling and heat dissipation structure. Background technique [0002] During the use of the mold, high temperature is often generated due to long-term use. High temperature will cause deformation of the mold and seriously affect the precision of parts processing. Therefore, it is necessary to cool down the mold with too high temperature in time. [0003] In the patent specification whose publication number is CN205255447U, a mold heat dissipation assembly is disclosed, which belongs to the mold field, and includes a water-cooled heat dissipation pipe, a water tank and a water circulation power pump; And the water circulation power pump is set in the circuit of the water-cooling heat pipe to circulate heat; this kind of mold heat dissipation component also includes an independent heat dissipation rod, which is inserted into the gap of the product in the mold to dissip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/73B29C45/76
CPCB29C45/73B29C45/76B29C2045/7606B29C2945/76916
Inventor 周承志
Owner HEFEI DINGXIN MOLD