Electronic equipment modular water cooling heat dissipation device

A technology for heat dissipation devices and electronic equipment, applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of inability to adjust the entire equipment, limited application scenarios, etc., achieve high environmental protection value and improve application Scenarios, the effect of improving applicability

Active Publication Date: 2017-08-25
凤阳凤辰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the radiator is fixed, and the application scenarios are limited. The positions of the heat exchanger and the fan are fixed, and cannot be adjusted for the entire device. If the device is modified or upgraded, the cooling system needs to be replaced

Method used

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  • Electronic equipment modular water cooling heat dissipation device
  • Electronic equipment modular water cooling heat dissipation device
  • Electronic equipment modular water cooling heat dissipation device

Examples

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Embodiment Construction

[0023] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0024] Such as figure 1 , figure 2 , image 3 and Figure 4 As shown, a modular cooling device for electronic equipment includes a water tank, an inlet water pump, an outlet water pump, and a circulating fluid, and also includes a circulation conduit 1, a heat exchanger 2, and a cooling plate 3; the circulation conduit 1 is a bendable metal tube , the two ends of the circulation conduit 1 communicate with the water tank through the water inlet pump and the water outlet pump; a plurality of heat exchangers 2 are arranged on the circulation conduit 1, and the heat exchangers 2 are funnel-shaped and contain a cavity inside, and the cross-sectional area of ​​the upper end of the heat exchanger 2 is greater than the lower e...

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PUM

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Abstract

The invention belongs to the technical field of heat dissipation equipment and particularly relates to an electronic equipment modular water cooling heat dissipation device. The device comprises a water tank, a water inflow water pump, a water outflow water pump, circulating liquid, a circulating guide pipe, heat exchangers, a heat dissipation plate and other functional parts. The heat dissipation plate is modularly assembled, a component for assembly is arranged on the plate, the circulating guide pipe can be freely arranged on the heat dissipation plate, the heat exchangers are communicated with the interior of the circulating guide pipe, the heat exchangers are connected with the exterior of the circulating guide pipe through elastic parts, the heat exchangers can be tightly connected with different kinds of electronic equipment, and the heat dissipation efficiency is improved. The device has the advantages of being wide in application range, excellent in heat dissipation effect and capable of being freely disassembled and reused.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation equipment, and in particular relates to a modular heat dissipation device for electronic equipment. Background technique [0002] Thermal effects are unavoidable in electrical components. Many electronic and electrical equipment will generate heat during operation. If the heat cannot be transferred out in time, the accumulation of heat will make the temperature of the working environment of the equipment too high. The temperature will affect the performance of electronic devices, and even cause irreversible damage to the components in severe cases, affecting the normal operation of the equipment. Therefore, many devices will be equipped with heat dissipation equipment for core components. [0003] In electronic and electrical equipment, heat dissipation equipment is usually divided into two types: air-cooled radiators and water-cooled radiators. The principles of the two are basically th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/2039
Inventor 吴青明
Owner 凤阳凤辰电子科技有限公司
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