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Substrate processing apparatus and substrate processing method

A substrate processing device and substrate processing technology, applied in discharge tubes, semiconductor/solid-state device testing/measurement, electrical components, etc.

Active Publication Date: 2021-11-12
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is no description about the method of distinguishing the cause of the abnormality of the exhaust gas in the heating device.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

Examples

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Embodiment Construction

[0039] An embodiment in which the substrate processing apparatus according to the embodiment of the present invention is applied to a resist coating apparatus having resist coating units 10A to 10D, wherein the resist coating units 10A to 10D are applied by spin coating The substrate processing unit applies a resist solution as a coating solution to the wafer W. The resist coating apparatus of this embodiment, such as figure 1 As shown, each of the plurality of resist coating units 10A to 10D is connected to a common exhaust unit 1 , and here, for convenience, it is configured to have four resist coating units 10A to 10D. Each of the resist coating units 10A to 10D has the same configuration, and here, the resist coating unit 10A will be described as an example.

[0040] Such as figure 2 As shown, the resist coating unit 10A has a spin chuck 11 serving as a substrate holding portion, and the spin chuck 11 holds the wafer W horizontally by vacuum suctioning the central porti...

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Abstract

The present invention provides a technology capable of reliably detecting abnormalities in independent exhaust passages of each substrate processing unit when the atmosphere of a plurality of substrate processing units generating an atmosphere containing adhering components is exhausted through a common exhaust passage. . When a plurality of resist coating units (10A to 10D) for resist coating on a wafer (W) are exhausted through a common exhaust passage (60) using an exhaust capability device, each resist is measured. The exhaust pressure of the independent exhaust pipes (50A-50D) of the coating units (10A-10D) is compared with the exhaust pressure of the common exhaust passage (60), and each measured value is compared with the corresponding allowable pressure range. Therefore, abnormalities such as clogging of deposits in the individual exhaust pipes ( 50A to 50D) can be reliably detected.

Description

technical field [0001] The present invention relates to a technique for exhausting the atmosphere of a substrate during substrate processing. Background technique [0002] In the etching process, which is one of the semiconductor manufacturing processes, a coating process of coating various coating liquids such as a resist or the like on the surface of a semiconductor wafer (hereinafter referred to as "wafer") is performed. For example, a resist coating apparatus uses a cup unit provided with a cup so as to surround a spin chuck as a holding portion of a substrate, and drips a coating liquid such as a resist liquid on a wafer on the spin chuck, The wafer is rotated to form a coating film on the entire surface. At this time, when the resist liquid dropped from the wafer collides with the wall surface of the cup, the resist liquid becomes fine particles (mist), and the mist adheres to the wafer to cause contamination. Therefore, an exhaust pipe is connected to the cup to exh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01J37/32H01J37/305
CPCH01J37/3053H01J37/32871H01L21/67063H01L21/67253H01J2237/3151H01J2237/334H01L21/0273H01L21/02307H01L21/67242H01L22/12
Inventor 梶原正幸安藤了至正木洋一稻田博一
Owner TOKYO ELECTRON LTD
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