Cloud-calculating high-speed-transmission parallel pair SFP + cable

A high-speed transmission, parallel line technology, applied in cables, insulated cables, communication cables, etc., can solve problems such as signal loss and crosstalk

Active Publication Date: 2017-09-15
LINKZ IND (SUZHOU) LTD
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  • Abstract
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  • Claims
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Problems solved by technology

The 10GBASE-T Ethernet symmetrical data cable widely used in the market cannot meet this short-distance transmission with low power consumption, high quality and high speed. The 10G SFP+ high-speed cable is used for high-speed data transmission in data center interconnection. However, the signal loss or crosstalk of the existing SFP+ high-speed cables is obvious

Method used

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  • Cloud-calculating high-speed-transmission parallel pair SFP + cable

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specific Embodiment

[0029] Specific examples, see figure 1 : An S-shaped semi-enclosed isolation belt 9 vertically isolates two sets of parallel wire pairs 5 vertically arranged up and down, the inner core 1 includes two sets of parallel wire pairs 5, and each set of parallel wire pairs 5 includes two horizontally arranged core wires 6. Two sets of parallel line pairs 5 are vertically stacked and arranged. The plane isolation part is specifically the horizontal isolation part 91, the first outward isolation part is specifically the first upward isolation part 92, and the second inward isolation part is specifically the second direction isolation part. The lower isolation part 93, one end of the horizontal isolation part 91 is bent upward to form the first upward isolation part 92, and the other end is bent downward to form the second downward isolation part 93. Outside the horizontal isolation portion 91, the adjacent parallel line pairs 5 in the lower relative position are located at the lower p...

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Abstract

The invention provides a cloud-calculating high-speed-transmission parallel pair SFP + cable. Signal loss crosstalk can be effectively avoided and signal quality is increased. The cable comprises an inner core, an external layer metal shielding layer and a sheath. The sheath wraps an outer wall of the external layer metal shielding layer. The inner core is arranged in an inner cavity of the external layer metal shielding layer. The inner core comprises at least two groups of parallel line pairs. Each group of the parallel line pair comprises two core lines which are arranged in parallel, a ground line and an internal layer metal shielding layer. The corresponding core line and a ground line are arranged in the inner cavity of the internal layer metal shielding layer. All the parallel line pairs are superposed and arranged in a parallel mode. The adjacent parallel line pairs are isolated through a S-shaped half-pack isolation strip in the parallel mode. The S-shaped half-pack isolation strip comprises a plane isolation portion, a first outward isolation portion and a second inward isolation portion. One end of the plane isolation portion is bended outwardly so as to form the first outward isolation portion and the other end is bended inwardly so as to form the second inward isolation portion.

Description

technical field [0001] The invention relates to the technical field of transmission cable structure, in particular to a parallel-to-SFP+ cable for cloud computing high-speed transmission. Background technique [0002] With the further development of virtualization technology, in order to meet the needs of the operating system and applications of personal servers in the data center, greater bandwidth and higher data transmission rates are required, which makes it urgent for data centers to provide cost-effective methods. Greater bandwidth. The 10GBASE-T Ethernet symmetrical data cable widely used in the market cannot meet this short-distance transmission with low power consumption, high quality and high speed. The 10G SFP+ high-speed cable is used for high-speed data transmission in data center interconnection. However, the signal loss or crosstalk of the existing SFP+ high-speed cables is obvious. Contents of the invention [0003] In view of the above problems, the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B11/00H01B7/17
CPCH01B7/17H01B11/002Y02A30/00
Inventor 方新春刘琳杨吉
Owner LINKZ IND (SUZHOU) LTD
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