Light emitting device and manufacturing method thereof
A light-emitting device and manufacturing method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of light-emitting device shape, material limitations, etc.
Active Publication Date: 2021-06-15
NICHIA CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0009] However, such a method needs to change the material and shape of the constituent members, so the shape and material of the light-emitting device that can be applied are sometimes limited.
Method used
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no. 1 approach ＞
[0072] [Structure of light emitting device]
[0073] refer to Figure 1A ~ Figure 1C The structure of the light emitting device of the first embodiment will be described.
[0074] Figure 1A It is a perspective view showing the structure of the light emitting device of the first embodiment. Figure 1B It is a plan view showing the structure of the light emitting device of the first embodiment. Figure 1C is a cross-sectional view showing the structure of the light emitting device according to the first embodiment, showing Figure 1B The profile at the IC-IC line.
[0075] It should be noted that, in Figure 1C In , portions surrounded by dotted lines in the vicinity of the upper surfaces of the light-shielding member and the light-transmitting member are respectively enlarged. In addition, in Figure 1C In , the two first fillers are represented by circles and rhombuses, and the second fillers are represented by circles. These shapes do not indicate the specific shapes of...
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Abstract
The present invention provides a light-emitting device with improved light extraction efficiency and a manufacturing method thereof. A light emitting device (100) includes a package (2), a light emitting element (1) provided on the package (2), and a translucent member (5) covering the light emitting element (1). There are a plurality of protrusions on the upper surface (5a) of the light-transmitting member (5) and the upper surface (4a) of the package (2), and the light-transmitting member (5) contains Particles of the translucent first filler (52) with a low refractive index of the base material (51), part of the particles of the first filler (52) from the upper surface (5a) of the translucent member (5) The base material (51) of the translucent member (5) is exposed to the air.
Description
technical field [0001] The present invention relates to a light emitting device including a light emitting element and a manufacturing method thereof. Background technique [0002] Light emitting diodes (LEDs) are used in various applications such as lighting fixtures, personal computers (PCs), TV backlights, and large displays. For LED light sources, as the demand for such various applications increases, the demand for improvement in light output is gradually increasing. [0003] For example, Patent Document 1 discloses an optical semiconductor device comprising: a wiring board having a recess; a light-emitting element housed in the recess; and a light-transmitting sealing member that seals the light-emitting The surface of the sealing member is roughened. Patent Document 2 discloses a light-emitting device including a substrate, a light-emitting element placed on the substrate, and a sealing member for sealing the light-emitting element, and unevenness is provided by arr...
Claims
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IPC IPC(8): H01L33/48H01L33/54H01L33/56H01L25/075
CPCH01L25/0753H01L33/486H01L33/54H01L33/56H01L2933/005H01L33/502H01L33/58H01L33/62H01L2224/48257H01L2924/181H01L2933/0041H01L2933/0058H01L2924/00012H01L2933/0091H01L2224/48247H01L2933/0066H01L2924/00014H01L2224/48091H01L33/508H01L33/20
Inventor 阿部耕治冈本康志
Owner NICHIA CORP