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Light-emitting device and method for manufacturing the same

A light-emitting device and manufacturing method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of light-emitting device shape, material limitation, etc., and achieve the effect of improving light export efficiency

Active Publication Date: 2017-12-08
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, such a method needs to change the material and shape of the constituent members, so the shape and material of the light-emitting device that can be applied are sometimes limited.

Method used

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  • Light-emitting device and method for manufacturing the same
  • Light-emitting device and method for manufacturing the same
  • Light-emitting device and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0072] [Structure of light emitting device]

[0073] refer to Figure 1A ~ Figure 1C The structure of the light emitting device of the first embodiment will be described.

[0074] Figure 1A It is a perspective view showing the structure of the light emitting device of the first embodiment. Figure 1B It is a plan view showing the structure of the light emitting device of the first embodiment. Figure 1C is a cross-sectional view showing the structure of the light emitting device according to the first embodiment, showing Figure 1B The profile at the IC-IC line.

[0075] It should be noted that, in Figure 1C In , portions surrounded by dotted lines in the vicinity of the upper surfaces of the light-shielding member and the light-transmitting member are respectively enlarged. In addition, in Figure 1C In , the two first fillers are represented by circles and rhombuses, and the second fillers are represented by circles. These shapes do not indicate the specific shapes of...

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PUM

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Abstract

A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.

Description

technical field [0001] The present invention relates to a light emitting device including a light emitting element and a manufacturing method thereof. Background technique [0002] Light emitting diodes (LEDs) are used in various applications such as lighting fixtures, personal computers (PCs), TV backlights, and large displays. For LED light sources, as the demand for such various applications increases, the demand for improvement in light output is gradually increasing. [0003] For example, Patent Document 1 discloses an optical semiconductor device comprising: a wiring board having a recess; a light-emitting element housed in the recess; and a light-transmitting sealing member that seals the light-emitting The surface of the sealing member is roughened. Patent Document 2 discloses a light-emitting device including a substrate, a light-emitting element placed on the substrate, and a sealing member for sealing the light-emitting element, and unevenness is provided by arr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/56H01L25/075
CPCH01L25/0753H01L33/486H01L33/54H01L33/56H01L2933/005H01L33/502H01L33/58H01L33/62H01L2224/48257H01L2924/181H01L2933/0041H01L2933/0058H01L2924/00012H01L2933/0091H01L2224/48247H01L2933/0066H01L2924/00014H01L2224/48091H01L33/508H01L33/20
Inventor 阿部耕治冈本康志
Owner NICHIA CORP