Connector-connected gate parallel connection substrate and gate drive substrate

A technology of connectors and connection bases, which is applied in the direction of output power conversion devices, pulse technology, electronic switches, etc., and can solve problems such as the inability to cope with the increase in the number of switching elements and the length of twisted cables.

Active Publication Date: 2020-01-03
ISAHAYA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the power conversion device of Patent Document 1 needs to connect the driving circuit (13) and the IGBTs (11), (12) respectively through twisted cables (31), (32), and connect the terminals (G) of the driving circuit (13) respectively. ), (E) and twisted cables (31), (32), so the length of twisted cables (31), (32) becomes longer, restricting the driving circuit (13), IGBT (11), (12 ) configuration such as
[0010] In addition, regarding the switch module of Patent Document 2, since the first wiring conductor (35) is composed of the first and fifth flat conductor parts (351), (352), the second wiring conductor (36) and the third wiring conductor (37) ) is composed of the second and third flat conductor parts (371), (372), so there is a problem that it cannot cope with the increase in the number of switching elements

Method used

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  • Connector-connected gate parallel connection substrate and gate drive substrate
  • Connector-connected gate parallel connection substrate and gate drive substrate
  • Connector-connected gate parallel connection substrate and gate drive substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] like figure 1 As shown, the connector-connected gate parallel connection board of Embodiment 1 (hereinafter referred to as "the connection board of Embodiment 1", and the same applies to Embodiment 2 etc.) has one end-side connector 2 provided on the connection board main body 1 On one end side of the connection board main body 1 , the other end side connector 3 , the gate connection electrode 4 and the emitter connection electrode 5 are provided on the other end side of the connection substrate main body 1 .

[0110] In addition, the one-end side connector 2 has the one-end side electrode 11 for outgoing wiring connection, the one-end side electrode 12 for returning wiring connection, and the one-end side electrode 13 for output wiring connection, and the other-end side connector 3 has the other end side for outgoing wiring connection. The electrode 14 , the other-end side electrode 15 for return wiring connection, and the other-end side electrode 16 for output wiring...

Embodiment 2

[0134] image 3 The connection board of Example 2 is shown.

[0135] The only difference from the connection substrate of the first embodiment is that the return connection wiring 18 and the gate connection electrode 4 are connected via the gate resistor 20 , and the element connection wiring 61 is used as a gate resistor circuit 62 .

[0136] And, according to the connection substrate of Embodiment 2, such as figure 2 As shown, the gate drive circuit substrate 25 does not need to be provided with the gate resistor 24. In addition, when using a drive circuit without a gate resistor, there is no need for a gate connection between the electrode 4 for gate connection and the gate electrode 82. Connect the gate resistor.

Embodiment 3

[0138] Figure 4 The connection board of Example 3 is shown.

[0139]The difference from the connection substrate of Example 1 is that the return connection wiring 18 and the electrode 4 for gate connection are connected through the primary side coil of the common mode choke coil, and the element connection wiring 61 is used as the primary side coil connection circuit 63 , via The secondary side coil of the common mode choke coil is connected to the output wiring and the emitter connection electrode, and the output connection wiring 71 is a secondary side coil connection circuit 73 .

[0140] Furthermore, according to the connection board of the third embodiment, it is possible to suppress the malfunction of the semiconductor element by the noise current generated by driving the power conversion device flowing in the driving wiring without changing the connection method between the connection board and the semiconductor package 8 .

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Abstract

The present invention is a connector-linked board having gates connected in parallel and gate drive board equipped with connectors for parallel connection, said boards being for the purpose of allowing for the wire lengths between drive circuits and semiconductor elements to be equalized simply by connecting the electrodes of adjacent connectors, allowing for an increase or decrease in the number of semiconductor elements to be accommodated, when connecting a plurality of semiconductor elements to drive circuits in parallel. In the present connector-linked board having gates connected in parallel, a main connection board 1 is provided with a one-end connector 2, an other-end connector 3, a gate connection electrode 4, and an emitter connection electrode 5. A one-end outgoing wire connection electrode 11, one-end incoming wire connection electrode 12, and one-end output wire connection electrode 13 of the one-end connector 2 are respectively connected, by an outgoing connection wire 17, incoming connection wire 18, and output wire 19, to an other-end outgoing wire connection electrode 14, other-end incoming wire connection electrode 15, and other-end output wire connection electrode 16 of the other-end connector 3. The incoming connection wire 18 and the gate connection electrode are connected by an element connection wire 61. The output wire 19 and the emitter connection electrode 5 are connected by an output connection wire 71.

Description

technical field [0001] The present invention relates to a connector-connected gate parallel connection substrate for driving a plurality of semiconductor elements in parallel by one drive circuit and a gate drive substrate with a parallel connection connector. Background technique [0002] In the past, when multiple voltage-driven semiconductor elements such as IGBTs and MOSFET modules were driven in parallel by one drive circuit, in order to minimize the variation in the switching time of each element, efforts were made to make the drive circuit as close as possible to the gate and emitter of each element. Wiring lengths up to the limit are the same. [0003] Therefore, it is necessary to balance the position of the drive circuit and the distances between the components, and there are great restrictions on the position where the drive circuit is arranged, which may hinder the miniaturization of the device. [0004] In addition, the wiring harness connecting the driver circ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H02M1/08H03K17/00
CPCH02M1/08H03K17/00
Inventor蒲池晴希
OwnerISAHAYA ELECTRONICS