An easy-to-maintain computer case

A computer and chassis technology, applied in the field of computers, can solve problems such as poor heat dissipation, abnormal operation of computers, and equipment failures, and achieve the effects of increasing the heat dissipation surface area, improving heat dissipation effects, and preventing equipment damage

Active Publication Date: 2020-11-06
CHANGZHOU COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a computer case that is easy to maintain, which solves the problem that when the external temperature is high, the heat dissipation effect of the traditional fan is poor, the equipment fails due to high temperature, and the computer cannot operate normally

Method used

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  • An easy-to-maintain computer case
  • An easy-to-maintain computer case

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0023] Such as Figure 1-2 As shown, the embodiment of the present invention provides a computer case that is easy to maintain, including a bottom plate 1, a connecting piece 32 is fixedly connected to the bottom of the bottom plate 1, and a traveling wheel 31 is fixedly connected to the bottom of the connecting piece 32. By providing the traveling wheel 31, It is convenient to move and transport the case and reduce physical consumption....

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Abstract

The invention discloses a computer case convenient to repair. The computer case comprises a bottom plate; a case body is fixedly connected to the top of the bottom plate; a placement groove is formedin the right side of the case body; a placement table is hinged to the interior of the placement groove; a sliding groove is formed in one side of the placement table; a sliding block is arranged in the sliding groove; and a connection rod is hinged to one side of the sliding block through a control bolt. A condenser, a cooling pipe and a water tank are arranged; through operation of the condenser, high-temperature air in the case body is cooled and condensed, and cooling water is led into the water tank to be collected through the cooling pipe; a heat-conducting fin and a cooling groove are arranged; by utilizing heat conduction of the heat-conducting fin, the cooling of a controller is accelerated; due to the arrangement of the cooling groove, the cooling surface area is enlarged and thecooling effect is improved; a first air blower, an air blowing pipe, a semiconductor cooling fin and an air inlet pipe are arranged; and by air blowing of the first air blower and refrigeration of the semiconductor cooling fin, a large amount of cold air is introduced through the air inlet pipe to perform air blowing cooling on the controller.

Description

Technical field [0001] The present invention relates to the field of computer technology, in particular to a computer case that is convenient for maintenance. Background technique [0002] With the development of computer technology, the configuration of the computer is getting higher and higher. With the improvement of the configuration, the amount of calculation of the installed programs and software is increasing. The heat of the computer is naturally increasing. The traditional computer heat dissipation is actually It is a process of heat transfer. The purpose is to bring the heat generated by the processor to other media and control the temperature of the central processing unit within a stable range to prevent high-temperature burnout of the equipment. Nowadays, most computer cooling devices are processors. The use of the fan and heat sink, through the rapid rotation of the fan, accelerates the flow of air, conducts the heat of the processor out and blows it into the nearby...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20B08B5/02B01D46/10
CPCB01D46/10B08B5/02G06F1/183G06F1/20
Inventor 周健单蓓
Owner CHANGZHOU COLLEGE OF INFORMATION TECH
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