A method to reduce the stick-slip behavior of solid-liquid interface under electric field
A technology of solid-liquid interface and behavior, applied in chemical instruments and methods, laboratory containers, laboratory utensils, etc., can solve the problems of large space occupied by equipment, difficulty in micro-vibration energy, surface reduction, etc., to avoid hysteresis effect , Reduce the stick-slip behavior of the solid-liquid interface and improve the control accuracy
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[0027] A method for reducing the stick-slip behavior of a solid-liquid interface under an electric field, comprising the following steps:
[0028] Step 1. Coating the surface of 150mm diameter with 300nm SiO 2 The silicon wafer was divided into 15mm*15mm samples, and then the back of the divided samples was polished with 800-grit sandpaper until the resistance value R<20Ω was measured with a digital multimeter, and then the experimental samples were placed in an ultrasonic cleaning machine, and alcohol and deodorizer were used. The ionized water was repeatedly washed until the water droplets on the surface of the sample could not be attached, and finally the experimental samples were placed in a holding cabinet; the cleaned silicon wafer samples were placed in a desktop homogenizer, and the Teflon AF1600 emulsion was spin-coated on the front of the sample by spin coating; The coating parameters are as follows: low speed 500r / min, time 20s; high speed 3000r / min, time 30s; the s...
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