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Method for reducing stick-slip behaviors of solid and liquid interface under electric field

A technology of solid-liquid interface and behavior, applied in chemical instruments and methods, laboratory containers, laboratory utensils, etc., can solve the problems of large space occupied by equipment, surface reduction, and difficulty in micro-vibration energy, and achieve good control accuracy , avoid hysteresis effect, and reduce the stick-slip behavior of solid-liquid interface

Active Publication Date: 2018-10-16
四川民惠科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stick-slip phenomenon prevents the continuous and smooth movement of micro-droplets on the solid surface, which will have an adverse effect on the precise control of micro-droplets
The stick-slip phenomenon of the three-phase contact line makes it impossible to guarantee the fluency and reliability of products based on electrowetting on the medium, which greatly affects the application and development of electrowetting on the medium technology in products
As far as method 1) is concerned, the surface energy of a solid cannot be reduced endlessly. When the surface energy reaches a certain threshold, the surface energy cannot be further reduced due to the influence of the properties of the material itself; although method 2) can reduce the viscosity of the solid-liquid interface- slipping phenomenon, but this method needs to provide an additional vibration source, the equipment takes up a large space, high energy consumption, and it is difficult to accurately apply tiny vibration energy, so it cannot be applied in actual working conditions; method 3) Although it can Significantly reduce the stick-slip phenomenon of the electrowetting solid-liquid interface on the medium, but requires a dedicated AC power supply
Not only that, as the microfluidic system develops toward miniaturization, miniaturization, and intelligence, its power source is mainly provided by direct current, so the use of alternating current power will make the system more complicated

Method used

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  • Method for reducing stick-slip behaviors of solid and liquid interface under electric field

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Embodiment 1

[0027] A method for reducing the stick-slip behavior of the solid-liquid interface under an electric field includes the following steps:

[0028] Step 1: Plating the surface with a diameter of 150mm with 300nm SiO 2 The silicon wafer is divided into 15mm*15mm samples, and then the back of the divided sample is polished with 800 grit sandpaper until the resistance value R is measured with a digital multimeter <20Ω, then put the experimental sample in an ultrasonic cleaning machine, repeatedly clean with alcohol and deionized water, until the water droplets on the surface of the sample can not adhere, and finally put the experimental sample in the holding cabinet; put the cleaned silicon wafer sample on the bench Glue homogenizer, spin-coated Teflon AF1600 emulsion on the front of the sample by spin coating; spin coating parameters are as follows: low speed 500r / min, time 20s; high speed 3000r / min, time 30s; put the spin-coated silicon wafer in a vacuum drying oven , Bake at 200°C f...

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Abstract

The invention discloses a method for reducing stick-slip behaviors of a solid and liquid interface under an electric field. The method is characterized in that the movement behavior of the micro-liquid droplet on the solid surface can be obviously improved, so that the micro-liquid droplet is more smoothly moved on the solid surface under the electric field; by changing the loading rate of direct-current voltage, the contact line of three phases of the micro-liquid droplet is suddenly changed under the function of high loading rate of direct-current voltage, so that the damping of the solid and liquid interface is overcome, and the stick-slip behaviors of the solid and liquid interface is effectively reduced; by comparing a relationship map of increasing of the length of the contact linesof the three phases of the micro-liquid droplet along with the electric wetting constant at different loading rates of direct-current voltage, the stick-slip behavior of the micro-liquid droplet on the solid and liquid interface at different voltage loading rates can be observed in real time. The method has the advantages that the movement smoothness of the micro-liquid droplet is increased by twotimes or more on the solid surface; the method is mainly based on direct-current programmable power supply, contact angle measurers and image processing software, the experiment method is simple andconvenient, and the result is visual, accurate and reliable.

Description

Technical field [0001] The invention belongs to the technical field of microfluidic control systems, and in particular relates to a method for reducing the stick-slip behavior of a solid-liquid interface under an electric field. Background technique [0002] The microfluidic control system is characterized by a microchannel network and integrates the functions of the entire laboratory on a microchip. It has broad application prospects in biological monitoring, environmental protection, aerospace and other fields. The core technology of the microfluidic control system is the precise driving and control of micro-droplets. Electrowetting on the medium has become one of the most popular micro-droplet driving technologies due to its advantages of low energy consumption, simple preparation and high reliability. Electro-wetting on the medium refers to isolating the conductive surface from the micro-droplets with an insulating layer, and changing the wetting characteristics of the solid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L3/50273B01L2300/06B01L2300/12B01L2300/165B01L2400/0427
Inventor 张亚锋王永宁吴晓兰余家欣姚永瑰
Owner 四川民惠科技有限公司