Method for reducing stick-slip behaviors of solid and liquid interface under electric field
A technology of solid-liquid interface and behavior, applied in chemical instruments and methods, laboratory containers, laboratory utensils, etc., can solve the problems of large space occupied by equipment, surface reduction, and difficulty in micro-vibration energy, and achieve good control accuracy , avoid hysteresis effect, and reduce the stick-slip behavior of solid-liquid interface
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[0027] A method for reducing the stick-slip behavior of the solid-liquid interface under an electric field includes the following steps:
[0028] Step 1: Plating the surface with a diameter of 150mm with 300nm SiO 2 The silicon wafer is divided into 15mm*15mm samples, and then the back of the divided sample is polished with 800 grit sandpaper until the resistance value R is measured with a digital multimeter <20Ω, then put the experimental sample in an ultrasonic cleaning machine, repeatedly clean with alcohol and deionized water, until the water droplets on the surface of the sample can not adhere, and finally put the experimental sample in the holding cabinet; put the cleaned silicon wafer sample on the bench Glue homogenizer, spin-coated Teflon AF1600 emulsion on the front of the sample by spin coating; spin coating parameters are as follows: low speed 500r / min, time 20s; high speed 3000r / min, time 30s; put the spin-coated silicon wafer in a vacuum drying oven , Bake at 200°C f...
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