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Formulation method and system for test specification of chip product

A product testing, product technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve problems such as heavy data processing workload

Active Publication Date: 2019-03-15
佛山中科芯蔚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention provides a method and system for formulating test specifications for chip products, which are used to solve the problem in the prior art that for the same chip product, it is necessary to formulate test specifications for each sub-product, and one chip product corresponds to multiple tests. specification, leading to the problem of heavy data processing workload

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  • Formulation method and system for test specification of chip product
  • Formulation method and system for test specification of chip product
  • Formulation method and system for test specification of chip product

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Embodiment Construction

[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0053] The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the...

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Abstract

The invention discloses a formulation method for a test specification of a chip product. The method comprises the steps of obtaining each to-be-tested sub-product contained in the target product; analyzing each test parameter included in each to-be-tested sub-product and determining an initial extreme value and offset extreme value corresponding to each test parameter; determining a test standardextreme value of each test parameter according to the corresponding initial extreme value and the corresponding offset extreme value; assigning each test standard extreme value to the corresponding to-be-tested sub-product to complete the formulation of the test specification of the target product. According to the formulation method, the test standard extreme values of the to-be-tested sub-products are collectively determined, and each test standard extreme value is assigned to the corresponding to-be-tested sub-product to complete the formulation of the test specification of the target product. One chip product corresponds to only one test specification, and the problems that it is needed to formulate a test specification for each sub-product, one chip product corresponds to multiple test specifications, and thus the data processing workload is large are avoided.

Description

[0001] This application claims the priority of the domestic application with the application number 201811171984.4 and the invention titled "A method and system for formulating a chip product testing specification", which was submitted to the China Patent Office on October 9, 2018, the entire contents of which are incorporated by reference in in this application. technical field [0002] The invention relates to the technical field of semiconductors, and in particular, to a method and system for formulating a test specification for a chip product. Background technique [0003] In the process of chip product testing, it is necessary to formulate test standards for the chips, and the test standards directly affect the yield rate and product performance indicators of product mass production. In the prior art, some chip products have multiple sub-products due to different packages and functions. The same test parameter is correlated across different sub-products. At this time,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851
Inventor 张晓晶陈岚
Owner 佛山中科芯蔚科技有限公司