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A method and system for formulating chip product test specifications

A product testing and product technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problem of heavy data processing workload and so on

Active Publication Date: 2021-07-20
佛山中科芯蔚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a method and system for formulating test specifications for chip products, which are used to solve the problem in the prior art that for the same chip product, it is necessary to formulate test specifications for each sub-product, and one chip product corresponds to multiple tests. specification, leading to the problem of heavy data processing workload

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  • A method and system for formulating chip product test specifications
  • A method and system for formulating chip product test specifications
  • A method and system for formulating chip product test specifications

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Embodiment Construction

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0053] The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein...

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Abstract

The invention discloses a method for formulating test specifications for chip products, comprising: obtaining each sub-product to be tested contained in a target product; analyzing each test parameter contained in each sub-product to be tested, and determining the initial pole corresponding to each test parameter value and offset extreme value; according to the initial extreme value and the offset extreme value, determine the test standard extreme value of each test parameter; assign each test standard extreme value to the corresponding sub-product to be tested, and complete The formulation of the target product test specification. The above formulation method centrally determines the test standard extreme value of each sub-product to be tested, assigns each test standard extreme value to the corresponding sub-product to be tested, and completes the formulation of the target product test specification. One chip product only corresponds to one test Specifications avoid the need to formulate test specifications for each sub-product, and one chip product corresponds to multiple test specifications, resulting in a large data processing workload.

Description

[0001] This application claims the priority of the domestic application with the application number 201811171984.4 submitted to the China Patent Office on October 09, 2018, and the title of the invention is "a method and system for formulating chip product test specifications", the entire content of which is incorporated by reference In this application. technical field [0002] The invention relates to the technical field of semiconductors, in particular to a method and system for formulating test specifications for chip products. Background technique [0003] In the process of chip product testing, it is necessary to formulate test standards for chips, which directly affect the yield rate and product performance indicators of product mass production. In the prior art, some chip products have multiple sub-products due to different packages and functions. The same test parameter is correlated between different sub-products. At this time, some or all of the sub-products nee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851
Inventor 张晓晶陈岚
Owner 佛山中科芯蔚科技有限公司