A reliable welding method for in-line metal package circuit modules
A technology of metal packaging and circuit modules, which is applied in the direction of assembling printed circuits with electrical components, and can solve problems such as damaged modules and abnormal module functions
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[0022] A reliable welding method for an in-line metal-encapsulated circuit module provided by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] A method for reliable welding of in-line metal package circuit modules provided by the present invention comprises the following steps:
[0024] Step 1, such as image 3 As shown, before soldering, a thermally conductive insulating pad with a special structural design is placed between the in-line metal package circuit module 3 and the printed circuit board 4. The thermally conductive insulating pad adopts a double-layer structure, including a thermally conductive insulating pad One 1 and heat conduction insulation mat two 2, use a heat conduction insulation mat with a silicon rubber base material of 0.25 mm thickness, and the superposition height of the two layers is 0.5 mm.
[0025] Such as figure 1 As shown, the heat-conducting insulating ...
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