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A reliable welding method for in-line metal package circuit modules

A technology of metal packaging and circuit modules, which is applied in the direction of assembling printed circuits with electrical components, and can solve problems such as damaged modules and abnormal module functions

Active Publication Date: 2020-10-23
BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional circuit module welding method has the following defects: during the welding process, when the height of the tin on the outer lead of the circuit module is high, part of the solder will flow into the surface of the glass insulator of the module (the connection between the outer lead and the module body). When the temperature of the external environment changes, the solder on the surface of the insulator will cause the overlap between the outer lead and the shell, which will eventually lead to abnormal function of the module and even damage the module

Method used

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  • A reliable welding method for in-line metal package circuit modules
  • A reliable welding method for in-line metal package circuit modules
  • A reliable welding method for in-line metal package circuit modules

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Embodiment Construction

[0022] A reliable welding method for an in-line metal-encapsulated circuit module provided by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] A method for reliable welding of in-line metal package circuit modules provided by the present invention comprises the following steps:

[0024] Step 1, such as image 3 As shown, before soldering, a thermally conductive insulating pad with a special structural design is placed between the in-line metal package circuit module 3 and the printed circuit board 4. The thermally conductive insulating pad adopts a double-layer structure, including a thermally conductive insulating pad One 1 and heat conduction insulation mat two 2, use a heat conduction insulation mat with a silicon rubber base material of 0.25 mm thickness, and the superposition height of the two layers is 0.5 mm.

[0025] Such as figure 1 As shown, the heat-conducting insulating ...

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Abstract

The invention belongs to the technical field of welding processes, and particularly relates to a reliable welding method for a direct insertion type metal packaging circuit module. The method comprises the following steps of 1, before welding, placing a heat conduction insulation pad between the direct insertion type metal packaging circuit module and a printed circuit board; 2, welding circuit module tube legs; and 3, using a 10mm long tin wire for first welding of a lead, and after the redundant part of the lead is cut, using a 10mm long tin wire additionally during remelting welding. The welding quality can be greatly improved, and defects in the prior art are effectively avoided.

Description

technical field [0001] The invention belongs to the technical field of welding technology, and in particular relates to a reliable welding method for an in-line metal package circuit module. Background technique [0002] With the development of magnetic materials, power electronic devices and digital processor technology, the combination of high-performance motors and modern control technology has led to the rapid rise of electromechanical servo technology. Nowadays, the application of electromechanical servo is more and more extensive, and it has convinced military and civilian multi-party user units with its "excellent reliability and practicability". The servo control drive is the key core unit of the electromechanical servo system. In-line metal package circuit modules with various specifications are usually used in the design, such as power supply modules and drive modules. The welding quality of these modules directly affects the function of the servo control drive. ,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
Inventor 龙海峰姜迪开李超陈庆浩
Owner BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS
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