Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and apparatus for flexible circuit cable connection

A flexible circuit, cable connection technology, applied in the direction of electrical connection of printed components, assembly of printed circuits with electrical components, circuits, etc.

Active Publication Date: 2022-04-12
JABLIN INC
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In summary, there are many challenges in connecting overlapping flex circuit cables to substrates, interposers, or other structures

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and apparatus for flexible circuit cable connection
  • Method and apparatus for flexible circuit cable connection
  • Method and apparatus for flexible circuit cable connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] It should be appreciated that the drawings and description of the embodiments of the method and apparatus for flexible circuit cable connections have been simplified to illustrate elements that are relevant to a clear understanding, while many other elements of a typical vehicle system have been eliminated for the sake of clarity. Those of ordinary skill in the art can recognize that other elements and / or steps are desirable and / or required in implementing the present invention. However, since these elements and steps are well known in the art, and because they do not facilitate a better understanding of the present invention, a discussion of these elements and steps is not provided here.

[0043] Non-limiting embodiments described herein relate to methods and apparatus for flexible circuit cable connections. The method and apparatus for flex circuit cabling can be modified for various applications and uses while remaining within the spirit and scope of the claims. The e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention describes a method and apparatus for multiple flexible circuit cable connections. Gold bumps are bonded to interconnect pads on the substrate to form columnar structures, and solder or conductive epoxy is dispensed on the flex cable circuit. Align and press the substrate and flex circuit cable together using force or by placing a heavy object on the substrate or flex circuit cable. Apply moderate heat to reflow the solder or cure the epoxy. With the aid of the gold bumps, the solder wets to the substrate pads and has a reduced risk of bridging due to the pillar structure. Apply a non-conductive underfill epoxy for added mechanical strength.

Description

technical field [0001] The present invention relates generally to flexible circuit cables, and more particularly to the attachment of flexible circuit cables to substrates. Background technique [0002] Flexible circuit cables are widely used for chip-to-printed circuit board (PCB), chip-to-substrate, optical subassembly-to-PCB, and PCB-to-PCB interconnections. They provide high-density signal routing capabilities in a limited space and in a flexible manner. However, previous methods for connecting flex circuit cables suffer from various disadvantages. [0003] For example, direct soldering of a single flex circuit cable connection or multiple flex circuit cable connections is possible or preferred when the flex circuit cables do not overlap. However, in the case of overlapping flex circuit cables, the thermal reflow of the solder will affect the chips or flex circuit cables already attached to the substrate. For example, if figure 1 As shown, when attempting to attach f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K1/11
CPCH05K3/3494H05K3/321H05K3/363H05K3/361H05K3/4015H05K1/111H05K1/117H05K13/0015H05K2203/049H05K2203/166B23K20/025B23K20/233B23K2101/42B23K2103/08B23K20/007B23K35/0222B23K35/3013Y02P70/50H01L24/80H01L21/84Y02P70/62B32B37/06B23K20/24
Inventor W·王M·A·特德曼M·P·桑托斯R·K·本茨H·李G·方
Owner JABLIN INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com