Component carrier, method of manufacturing component carrier, and method of use
A component bearing and component technology, applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve problems such as artifacts and reduce the overall performance of mobile communication systems, and achieve the effect of avoiding reflections
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[0076] figure 1 A three-dimensional sectional view of a component carrier 100 according to an exemplary embodiment of the invention is shown.
[0077] The illustrated component carrier 100 comprises a first layer stack 102 having a plurality of first electrically insulating layer structures 104 and a plurality of first electrically conductive layer structures 106 which 106 includes a wall-shaped conductive first connector 110 having a first exposed planar conductive surface 108 (see also detail 189). Furthermore, the component carrier 100 comprises a second layer stack 112 which in turn comprises a plurality of second electrically insulating layer structures 114 and a plurality of second electrically conductive layer structures 116 which A wall-shaped conductive second connection body 120 having a second exposed planar conductive surface 118 is included.
[0078] As shown, the third layer stack 152 may be vertically sandwiched between the first layer stack 102 and the secon...
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