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Component carrier, method of manufacturing component carrier, and method of use

A component bearing and component technology, applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve problems such as artifacts and reduce the overall performance of mobile communication systems, and achieve the effect of avoiding reflections

Pending Publication Date: 2021-01-12
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, artifacts may appear when high-frequency signals propagating along the wiring structure of the component carrier are mixed or multiplied with each other to generate a distorted signal
In addition, signal reflections are also an undesirable phenomenon
This will greatly reduce the overall performance of the mobile communication system, etc.

Method used

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  • Component carrier, method of manufacturing component carrier, and method of use
  • Component carrier, method of manufacturing component carrier, and method of use
  • Component carrier, method of manufacturing component carrier, and method of use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0076] figure 1 A three-dimensional sectional view of a component carrier 100 according to an exemplary embodiment of the invention is shown.

[0077] The illustrated component carrier 100 comprises a first layer stack 102 having a plurality of first electrically insulating layer structures 104 and a plurality of first electrically conductive layer structures 106 which 106 includes a wall-shaped conductive first connector 110 having a first exposed planar conductive surface 108 (see also detail 189). Furthermore, the component carrier 100 comprises a second layer stack 112 which in turn comprises a plurality of second electrically insulating layer structures 114 and a plurality of second electrically conductive layer structures 116 which A wall-shaped conductive second connection body 120 having a second exposed planar conductive surface 118 is included.

[0078] As shown, the third layer stack 152 may be vertically sandwiched between the first layer stack 102 and the secon...

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Abstract

The present invention relates to a component carrier comprising a first stack comprising at least one first electrically insulating layer structure and at least one first electrically conductive layerstructure, the at least one first electrically conductive layer structure having a first connector with a first exposed planar electrically conductive surface; and a second stack comprising at leastone second electrically insulating layer structure and at least one second electrically conductive layer structure, wherein the at least one second electrically insulating layer structure is providedwith a second connecting body, and the second connecting body is provided with a second exposed plane conducting surface; the first stack and the second stack are connected to each other such that thefirst exposed planar conductive surface and the second exposed planar conductive surface are connected to establish the vertical two-dimensional conductive connection. The invention also relates to amethod of manufacturing the component carrier and to a method of using the component carrier for high-frequency applications and / or for high-power applications.

Description

technical field [0001] The invention relates to a component carrier, a method of producing the component carrier and a method of use. Background technique [0002] In the case of increasing product functions of component carriers equipped with one or more electronic components and the increasing miniaturization of such electronic components and the increase in the number of electronic components to be mounted on component carriers such as printed circuit boards, the use of Increasingly powerful array-like components or packages with several electronic components having multiple contacts or connections with increasingly smaller spacing between the contacts. Removal of the heat generated by such electronic components and the component carrier itself during operation is an increasing problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under severe conditions. [0003] Furthermore, artifac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48H05K1/02H05K3/46
CPCH01L23/49833H01L23/49822H01L23/49811H01L21/4846H05K1/0242H05K3/4644H05K3/4697H05K2201/037H01L21/50H01L21/76802H01L23/5384H01L23/5385H01L23/5386H01L23/64H01L25/0657
Inventor 伯恩哈德·赖特迈尔塞巴斯蒂安·萨特勒埃里克·施拉费尔
Owner AT & S AUSTRIA TECH & SYSTTECHN AG
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